High power radiation emitter device and heat dissipating package for electronic components
First Claim
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1. A package for at least one electronic semiconductor component, said package comprising:
- first and second substrates sealed together and spaced apart to define a sealed chamber;
a colored liquid or colored gel contained in said sealed chamber for filtering light emitted from the sealed chamber;
at least one electronic semiconductor component disposed in said sealed chamber in thermal contact with said colored liquid or colored gel such that heat is conducted by the sides of the sealed chamber; and
wherein the at least one electronic semiconductor component is positioned within the sealed chamber such that light emitted from the at least one electronic component escapes the sealed chamber after passing through said colored liquid or colored gel.
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Abstract
The electronic component package of the present invention includes a sealed chamber; a liquid or gel contained in the sealed chamber; at least one electronic component disposed in the sealed chamber in physical and thermal contact with the liquid or gel; and at least one electrical conductor electrically coupled to the electronic component and extending out of the sealed chamber. The electronic component(s) may include any one or combination of a radiation emitter, a thermal or optical sensor, a resistor, and a microprocessor or other semiconductor component.
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Citations
26 Claims
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1. A package for at least one electronic semiconductor component, said package comprising:
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first and second substrates sealed together and spaced apart to define a sealed chamber; a colored liquid or colored gel contained in said sealed chamber for filtering light emitted from the sealed chamber; at least one electronic semiconductor component disposed in said sealed chamber in thermal contact with said colored liquid or colored gel such that heat is conducted by the sides of the sealed chamber; and wherein the at least one electronic semiconductor component is positioned within the sealed chamber such that light emitted from the at least one electronic component escapes the sealed chamber after passing through said colored liquid or colored gel. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A package for at least one electronic component, said package comprising:
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a circuit board and a substrate, sealed together and spaced apart to define a sealed chamber; a colored liquid or colored gel contained in said sealed chamber for filtering light emitted therefrom; at least one light emitting diode (LED) mounted on said circuit board and disposed in said sealed chamber in thermal contact with said colored liquid or colored gel; and wherein the at least one light emitting diode (LED) is positioned within the sealed chamber such that light escapes the sealed chamber after passing through said colored liquid or colored gel. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23)
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24. A package for at least one electronic component, said package comprising:
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a circuit board and a substrate, sealed together and spaced apart to define a sealed chamber having a substantially clear section for passing light; a color tinted liquid or color tinted gel contained within the sealed chamber for selectively filtering light emitted therefrom; an optical sensor mounted on said circuit board and disposed in said sealed chamber; at least one light emitting diode (LED) mounted on said circuit board and disposed in said sealed chamber in thermal contact with said color tinted liquid or colored tinted gel; and wherein the at least one LED and optical sensor are positioned within the sealed chamber such that light enters and escapes the sealed chamber after passing through said color tinted liquid or colored tinted gel. - View Dependent Claims (25, 26)
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Specification