Process condition measuring device with shielding
First Claim
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1. A method of forming a process condition measuring device having protection against electromagnetic fields, comprising:
- forming a first substrate portion of a conductive material;
forming a first contact pad on the first substrate portion, the first contact pad in direct electrical contact with the first substrate portion;
forming a second substrate portion of the conductive material;
forming a second contact pad on the second substrate portion, the second contact pad in direct electrical contact with the second substrate portion;
placing an electronic circuit between the first substrate portion and the second substrate portion; and
subsequently, connecting the first substrate portion and the second substrate portion together, with the electronic circuit between them, such that the first contact pad is electrically connected to the second padwherein the conductive material is doped Silicon.
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Abstract
A process condition measuring device has electronic components sandwiched between two conductive substrate portions. The conductive substrate portions are joined by an electrically conductive pathway. Native oxide is removed from substrate portions and electrically conductive contact pads are formed that are then joined together with electrically conductive adhesive to form the electrically conductive pathway. Sensors may be located on the exterior of the process condition measuring device with conductive leads extending to shielded electronic components.
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Citations
9 Claims
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1. A method of forming a process condition measuring device having protection against electromagnetic fields, comprising:
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forming a first substrate portion of a conductive material; forming a first contact pad on the first substrate portion, the first contact pad in direct electrical contact with the first substrate portion; forming a second substrate portion of the conductive material; forming a second contact pad on the second substrate portion, the second contact pad in direct electrical contact with the second substrate portion; placing an electronic circuit between the first substrate portion and the second substrate portion; and subsequently, connecting the first substrate portion and the second substrate portion together, with the electronic circuit between them, such that the first contact pad is electrically connected to the second pad wherein the conductive material is doped Silicon. - View Dependent Claims (2)
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3. A method of forming a process condition measuring device having protection against electromagnetic fields, comprising:
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forming a first substrate portion of a conductive material; forming a first contact pad on the first substrate portion, the first contact pad in direct electrical contact with the first substrate portion; forming a second substrate portion of the conductive material; forming a second contact pad on the second substrate portion, the second contact pad in direct electrical contact with the second substrate portion; placing an electronic circuit between the first substrate portion and the second substrate portion; and subsequently, connecting the first substrate portion and the second substrate portion together, with the electronic circuit between them, such that the first contact pad is electrically connected to the second pad wherein the first substrate portion and the second substrate portion connected together, with the electronic circuit between them form an assembly that has at least one dimension that is the same as a dimension of a standard Silicon wafer and wherein the assembly is a disk with a diameter of 150 millimeters, 200 millimeters or 300 millimeters.
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4. A method of forming a process condition measuring device having protection against electromagnetic fields, comprising:
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forming a first substrate portion of a conductive material; forming a first contact pad on the first substrate portion, the first contact pad in direct electrical contact with the first substrate portion; forming a second substrate portion of the conductive material; forming a second contact pad on the second substrate portion, the second contact pad in direct electrical contact with the second substrate portion; placing an electronic circuit between the first substrate portion and the second substrate portion; and subsequently, connecting the first substrate portion and the second substrate portion together, with the electronic circuit between them, such that the first contact pad is electrically connected to the second pad, wherein placing the electronic circuit between the first substrate portion and the second substrate portion includes sandwiching the electronic circuit between the first and second substrate portions such that the first contact pad faces the second contact pad. - View Dependent Claims (5, 6)
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7. A method of forming a process condition measuring device having protection against electromagnetic fields, comprising:
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forming a first substrate portion of a conductive material; forming a first contact pad on the first substrate portion, the first contact pad in direct electrical contact with the first substrate portion; forming a second substrate portion of the conductive material; forming a second contact pad on the second substrate portion, the second contact pad in direct electrical contact with the second substrate portion; placing an electronic circuit between the first substrate portion and the second substrate portion; and subsequently, connecting the first substrate portion and the second substrate portion together, with the electronic circuit between them, such that the first contact pad is electrically connected to the second pad, wherein connecting the first substrate portion and the second substrate portion together forms a conductive shield that protects the electronic circuit against electromagnetic fields. - View Dependent Claims (8, 9)
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Specification