Process Condition Measuring Device with Shielding
First Claim
1. A process condition measuring device for measuring a process condition in a processing system that processes workpieces of standard dimensions, comprising:
- a first conductive substrate portion;
a second conductive substrate portion;
an electrical circuit interposed between the first conductive substrate portion and the second conductive substrate portion; and
the first and second conductive substrate portions electrically connected together to form an electrically continuous body that has at least one dimension that is equal to a dimension of a workpiece processed by the processing system.
1 Assignment
0 Petitions
Accused Products
Abstract
A process condition measuring device has electronic components sandwiched between two conductive substrate portions. The conductive substrate portions are joined by an electrically conductive pathway. Native oxide is removed from substrate portions and electrically conductive contact pads are formed that are then joined together with electrically conductive adhesive to form the electrically conductive pathway. Sensors may be located on the exterior of the process condition measuring device with conductive leads extending to shielded electronic components.
88 Citations
22 Claims
-
1. A process condition measuring device for measuring a process condition in a processing system that processes workpieces of standard dimensions, comprising:
-
a first conductive substrate portion;
a second conductive substrate portion;
an electrical circuit interposed between the first conductive substrate portion and the second conductive substrate portion; and
the first and second conductive substrate portions electrically connected together to form an electrically continuous body that has at least one dimension that is equal to a dimension of a workpiece processed by the processing system. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A method of forming a process condition measuring device having protection against electromagnetic fields, comprising;
-
forming a first substrate portion of a conductive material;
forming a first contact pad on the first substrate portion, the first contact pad in direct electrical contact with the first substrate portion;
forming a second substrate portion of the conductive material;
forming a second contact pad on the second substrate portion, the second contact pad in direct electrical contact with the second substrate portion;
placing an electronic circuit between the first substrate portion and the second substrate portion; and
subsequently, connecting the first substrate portion and the second substrate portion together, with the electronic circuit between them, such that the first contact pad is electrically connected to the second contact pad. - View Dependent Claims (8, 9, 10, 11)
-
-
12. A process condition measuring device for measuring a process condition in a processing system that processes workpieces of standard dimensions, comprising:
-
a first non-conductive substrate portion having at least one dimension equal to a dimension of a standard workpiece, the first non-conductive substrate portion having a first conductive layer deposited on a first surface;
a second substrate portion having at least a second conductive layer;
an electrical circuit interposed between the first non-conductive substrate portion and the second substrate portion; and
the first conductive layer and the at least a second conductive layer electrically connected together to form an electrically continuous body. - View Dependent Claims (13, 14, 15, 16, 17)
-
-
18. A method of forming a process condition measuring device having protection against electromagnetic fields, comprising;
-
forming a first substrate portion of a non-conductive material;
forming a first conductive layer on a first surface of the first substrate portion;
forming a second substrate portion having at least a second conductive layer;
placing an electronic circuit between the first substrate portion and the second substrate portion; and
subsequently, connecting the first conductive layer of the first substrate portion and the at least a second conductive layer of the second substrate portion, while the electronic circuit is between them, such that the first conductive layer is electrically connected to the at least a second conductive layer. - View Dependent Claims (19, 20, 21, 22)
-
Specification