Article having display device

• US 7,652,359 B2
• Filed: 12/12/2003
• Issued: 01/26/2010
• Est. Priority Date: 12/27/2002
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Goto, Yuugo, Ohno, Yumiko, Takayama, Toru, Maruyama, Junya, Akiba, Mai
• Primary Examiner(s): Vu; David
• Assistant Examiner(s): Taylor; Earl N
• Application Number:
  US10/733,260
• Publication Number:
  US 20040128246A1
• Time in Patent Office: 2,237 Days
• Field of Search: 705/30, 705/33, 705/39, 705/41, 705/42, 235/492, 235/380, 235/382.5, 235/375, 349149-152, 257/679, 257/E23.064, 315/169.3
• US Class Current: 257/679
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07703 the interface being visual
• CPC Class Codes: G06Q 20/105 involving programming of a portable memory device, e.g. IC cards, "electronic purses"
• CPC Class Codes: G06Q 20/3415 Cards acting autonomously as pay-media
• CPC Class Codes: G07F 7/1008 Active credit-cards provided with means to personalise their use, e.g. with PIN-introduction/comparison system
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/10271 Silicon-germanium [SiGe]
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

It is an object of the present invention to provide a highly sophisticated functional IC card that can ensure security by preventing forgery such as changing a picture of a face, and display other images as well as the picture of a face. An IC card comprising a display device and a plurality of thin film integrated circuits; wherein driving of the display device is controlled by the plurality of thin film integrated circuits; a semiconductor element used for the plurality of thin film integrated circuits and the display device is formed by using a polycrystalline semiconductor film; the plurality of thin film integrated circuits are laminated; the display device and the plurality of thin film integrated circuits are equipped for the same printed wiring board; and the IC card has a thickness of from 0.05 mm to 1 mm.

Claims

1. An article comprising:

a substrate having a contact hole;

a display device mounted on one side of the substrate by an adhesive agent;

a thin film integrated circuit equipped on the other side of the substrate;

a sealant;

a lead provided on the substrate;

a terminal provided in the display device;

a first wire electrically connected to the lead and the terminal; and

a second wire electrically connected to the lead and the thin film integrated circuit,

wherein the display device is electrically connected to the thin film integrated circuit through the contact hole,

wherein each of the display device and the thin film integrated circuit comprises a polycrystalline semiconductor film,

wherein the thin film integrated circuit comprises a memory and a CPU, and

wherein the substrate, the display device, and the thin film integrated circuit are sealed with the sealant so that a pixel portion of the display device is exposed.

2. The article according to claim 1, wherein the display device is a liquid crystal display device or a light emitting device.

10. The article according to claim 1, wherein the substrate is a printed wiring board.

11. The article according to claim 10, wherein the printed wiring board is selected from the group consisting of a ceramic substrate, a glass epoxy substrate and a polyimide substrate.

12. The article according to claim 1, further comprising a plurality of antenna coils.

22. The article according to claim 1, wherein the display device has at least QVGA of resolution.

26. The article according to claim 1, wherein the thin film integrated circuit further comprises a driver circuit of the display device.

30. The article according to claim 1, wherein the substrate comprises a material having a thermal conductivity of from 2 W/mK to 30 W/mK.

34. The article according to claim 1, wherein the adhesive agent is mixed with powder comprising silver, nickel, aluminum, or aluminum nitride, or filler.

38. The article according to claim 1, wherein the article is an IC card.

3. An article comprising:

a substrate having a contact hole;

a display device mounted on one side of the substrate by an adhesive agent;

a thin film integrated circuit equipped on the other side of the substrate;

a sealant;

a lead provided on the substrate;

a terminal provided in the display device;

a first wire electrically connected to the lead and the terminal; and

a second wire electrically connected to the lead and the thin film integrated circuit,

wherein the display device is electrically connected to the thin film integrated circuit through the contact hole,

wherein each of the display device and the thin film integrated circuit comprises a polycrystalline semiconductor film,

wherein the article has a thickness of from 0.05 mm to 1 mm,

wherein the thin film integrated circuit comprises a memory and a CPU, and

wherein the substrate, the display device, and the thin film integrated circuit are sealed with the sealant so that a pixel portion of the display device is exposed.

4. The article according to claim 3, wherein the display device is a liquid crystal display device or a light emitting device.

13. The article according to claim 3, wherein the substrate is a printed wiring board.

14. The article according to claim 13, wherein the printed wiring board is selected from the group consisting of a ceramic substrate, a glass epoxy substrate and a polyimide substrate.

15. The article according to claim 3, further comprising a plurality of antenna coils.

23. The article according to claim 3, wherein the display device has at least QVGA of resolution.

27. The article according to claim 3, wherein the thin film integrated circuit further comprises a driver circuit of the display device.

31. The article according to claim 3, wherein the substrate comprises a material having a thermal conductivity of from 2 W/mK to 30 W/mK.

35. The article according to claim 3, wherein the adhesive agent is mixed with powder comprising silver, nickel, aluminum, or aluminum nitride, or filler.

39. The article according to claim 3, wherein the article is an IC card.

5. An article comprising:

a substrate having a contact hole;

a display device mounted on one side of the substrate by an adhesive agent; and

a thin film integrated circuit equipped on the other side of the substrate;

a sealant;

a lead provided on the substrate;

a terminal provided in the display device;

a first wire electrically connected to the lead and the terminal; and

a second wire electrically connected to the lead and the thin film integrated circuit,

wherein the display device is electrically connected to the thin film integrated circuit through the contact hole,

wherein each of the display device and the thin film integrated circuit comprises a polycrystalline semiconductor film,

wherein the display device is a passive matrix type or an active matrix type,

wherein the article has a thickness of from 0.05 mm to 1 mm,

wherein the thin film integrated circuit comprises a memory and a CPU, and

wherein the substrate, the display device, and the thin film integrated circuit are sealed with the sealant so that a pixel portion of the display device is exposed.

6. The article according to claim 5, wherein the display device is a liquid crystal display device or a light emitting device.

16. The article according to claim 5, wherein the substrate is a printed wiring board.

17. The article according to claim 16, wherein the printed wiring board is selected from the group consisting of a ceramic substrate, a glass epoxy substrate and a polyimide substrate.

18. The article according to claim 5, further comprising a plurality of antenna coils.

24. The article according to claim 5, wherein the display device has at least QVGA of resolution.

28. The article according to claim 5, wherein the thin film integrated circuit further comprises a driver circuit of the display device.

32. The article according to claim 5, wherein the substrate comprises a material having a thermal conductivity of from 2 W/mK to 30 W/mK.

36. The article according to claim 5, wherein the adhesive agent is mixed with powder comprising silver, nickel, aluminum, or aluminum nitride, or filler.

40. The article according to claim 5, wherein the article is an IC card.

7. An article comprising:

a substrate having a contact hole;

a display device mounted on one side of the substrate by an adhesive agent; and

a plurality of thin film integrated circuits equipped on the other side of the substrate;

a sealant;

a lead provided on the substrate;

a terminal provided in the display device;

a first wire electrically connected to the lead and the terminal; and

a second wire electrically connected to the lead and the thin film integrated circuit,

wherein the display device is electrically connected to the plurality of thin film integrated circuits through the contact hole,

wherein each of the display device and the plurality of thin film integrated circuits comprises a polycrystalline semiconductor film,

wherein the plurality of thin film integrated circuits are laminated,

wherein the article has a thickness of from 0.05 mm to 1 mm,

wherein the thin film integrated circuit comprises a memory and a CPU, and

wherein the substrate, the display device, and the plurality of thin film integrated circuits are sealed with the sealant so that a pixel portion of the display device is exposed.

8. The article according to claim 7, wherein thicknesses of the plurality of thin film integrated circuits are each from 1 μ

m to 5 μ

m.

9. The article according to claim 7, wherein the display device is a liquid crystal display device or a light emitting device.

19. The article according to claim 7, wherein the substrate is a printed wiring board.

20. The article according to claim 19, wherein the printed wiring board is selected from the group consisting of a ceramic substrate, a glass epoxy substrate and a polyimide substrate.

21. The article according to claim 7, further comprising a plurality of antenna coils.

25. The article according to claim 7, wherein the display device has at least QVGA of resolution.

29. The article according to claim 7, wherein the thin film integrated circuit further comprises a driver circuit of the display device.

33. The article according to claim 7, wherein the substrate comprises a material having a thermal conductivity of from 2 W/mK to 30 W/mK.

37. The article according to claim 7, wherein the adhesive agent is mixed with powder comprising silver, nickel, aluminum, or aluminum nitride, or filler.

41. The article according to claim 7, wherein the article is an IC card.