Radio frequency identification (RFID) tag lamination process using liner

• US 7,674,649 B2
• Filed: 08/06/2008
• Issued: 03/09/2010
• Est. Priority Date: 03/14/2005
• Status: Expired due to Fees

• Current Assignee: RCD Technology Corporation
• Original Assignee: RCD Technology Corporation
• Inventors: Oberle, Robert R.
• Primary Examiner(s): COLEMAN, WILLIAM D
• Application Number:
  US12/187,143
• Publication Number:
  US 20080311704A1
• Time in Patent Office: 580 Days
• Field of Search: 438/64, 438/119, 257/E2.506, 156/379.7
• US Class Current: 438/64
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 23/3164 the coating being a foil
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H05K 2201/10628 Leaded surface mounted device soldering surface mounted leaded components H05K3/3421
• CPC Class Codes: H05K 2203/1311 Foil encapsulation, e.g. of mounted components
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: H05K 3/3485 Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12
• CPC Class Codes: Y02P 80/30 Reducing waste in manufacturing processes; Calculations of released waste quantities

Abstract

A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.

Claims

1. A method of constructing an RFID unit comprising:

attaching an integrated circuit chip to a substrate with an antenna unit using an electrically conductive adhesive; and

laminating a protective layer over at least part of the integrated circuit chip while the electrically conductive adhesive has not yet fully set.

2. The method of claim 1, wherein the integrated circuit chip is part of a chip module.

3. The method of claim 1, wherein any dwell time between the attaching and laminating steps is less than less than minute.

4. The method of claim 1, wherein the attachment step is done at a rate of one attachment per second or greater.

5. The method of claim 1, wherein the electrically conductive adhesive takes over a day to fully set.

6. The method of claim 1, wherein the electrically conductive adhesive is solder paste.

7. The method of claim 1, wherein the integrated circuit chip is attached to the protective layer before the attaching step.

8. The method of claim 1, wherein the protective layer is stretchy to conform to IC chip.

9. The method of claim 2, wherein the chip module includes a lead frame.

10. The method of claim 2, wherein attaching step comprises using the electrically conductive adhesive to connect a connection element of the module to the substrate.

11. An apparatus to construct an RFID device comprising:

a unit to attach an integrated circuit chip to a substrate with an antenna using an electrically conductive adhesive; and

a unit to laminate a protective layer over at least part of the integrated circuit chip while the electrically conductive adhesive has not yet fully set.

12. The apparatus of claim 11, wherein the integrated circuit chip is part of a chip module.

13. The apparatus of claim 12, wherein the laminating unit connects a strip of the protective layer to a strip of the substrate.

14. The apparatus of claim 12, wherein the laminating unit uses hot rollers.

15. The apparatus of claim 12, wherein the attaching unit operates at a rate of one attachment per second or greater.

16. The apparatus of claim 12, wherein the integrated circuit chip is attached to the protective layer before the attaching unit.

17. A method of constructing an flexible circuit comprising:

attaching an integrated circuit chip to a substrate with an circuit traces using an electrically conductive adhesive; and

;

laminating a protective layer over at least part of the integrated circuit chip while the adhesive has not yet fully set.