Packaging a MEMS device using a frame
First Claim
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1. A method of manufacturing a microelectromechanical systems (MEMS) based display device, the method comprising:
- providing a transparent substrate comprising at least one MEMS device formed thereon;
providing a backplate;
providing a plurality of seal pieces configured to fit together to form a frame that circumscribes the MEMS device, wherein the frame has a first bonding surface and a second bonding surface and wherein the frame comprises at least one corner comprising a crevice that provides an air permeable passageway between the seal pieces and allows gas to exit the MEMS device prior to packaging and sealing; and
forming a MEMS package wherein the transparent substrate is joined to the first bonding surface of the frame with a bonding material disposed between the first bonding surface and the substrate, and the second bonding surface of the frame is joined to the backplate.
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Abstract
A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to a frame that circumscribes the modulator array. The frame is bonded to the transparent substrate and to the backplate to provide a hermetic package.
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Citations
36 Claims
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1. A method of manufacturing a microelectromechanical systems (MEMS) based display device, the method comprising:
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providing a transparent substrate comprising at least one MEMS device formed thereon; providing a backplate; providing a plurality of seal pieces configured to fit together to form a frame that circumscribes the MEMS device, wherein the frame has a first bonding surface and a second bonding surface and wherein the frame comprises at least one corner comprising a crevice that provides an air permeable passageway between the seal pieces and allows gas to exit the MEMS device prior to packaging and sealing; and forming a MEMS package wherein the transparent substrate is joined to the first bonding surface of the frame with a bonding material disposed between the first bonding surface and the substrate, and the second bonding surface of the frame is joined to the backplate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 28, 29)
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10. A microelectromechanical systems (MEMS) based device, comprising:
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a transparent substrate comprising at least one MEMS device formed thereon; a frame circumscribing the MEMS device, wherein the frame comprises a first and a second bonding surface; one or more air permeable passageways formed at one or more corners of the frame, the one or more passageways configured to allow gas to exit the MEMS device prior to packaging and sealing; a seal comprising a bonding material disposed between and joining the first bonding surface and the substrate; and a backplate sealed to the second bonding surface and forming a MEMS device package. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 30)
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25. A microelectromechanical (MEMS) device, comprising:
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means for supporting a MEMS, having a MEMS device formed thereon; means for enclosing a MEMS package; a glass frame that substantially circumscribes the MEMS device and comprises a sealed crevice in at least one corner, wherein the sealed crevice is configured to allow gas to exit the MEMS device prior to packaging and sealing; and means for bonding the frame to the supporting means. - View Dependent Claims (26, 27, 31, 32, 33, 34, 35, 36)
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Specification