Hermetic implantable stimulator
First Claim
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1. A method of forming an implantable medical device, comprising:
- providing an electronic assembly comprising a circuit board and one or more electronic components mounted on the circuit board;
electrically coupling a feedthru pin to the electronic assembly;
applying a mask to a portion of the feedthru pin;
encapsulating the electronic assembly with a non-metallic hermetic composite after the mask has been applied to the feedthru pin to seal the electronic assembly from a body environment;
removing the mask from the feedthru pin to expose the portion of the feedthru pin;
andcoupling a connector assembly to the exposed portion of the feedthru pin after the electronic assembly has been encapsulated with the non-metallic hermetic composite.
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Abstract
An implantable medical device, e.g., an implantable pulse generator, having a non-metal sealed housing and method of making same. An exemplary embodiment of the device includes a replenishable power source, coupling electronic components configured to generate a pulse signal to the replenishable power source, and an inorganic coating covering the electronic components and the power source to seal, preferably hermetically, the electronic components and the power source from a body environment.
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Citations
26 Claims
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1. A method of forming an implantable medical device, comprising:
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providing an electronic assembly comprising a circuit board and one or more electronic components mounted on the circuit board; electrically coupling a feedthru pin to the electronic assembly; applying a mask to a portion of the feedthru pin; encapsulating the electronic assembly with a non-metallic hermetic composite after the mask has been applied to the feedthru pin to seal the electronic assembly from a body environment; removing the mask from the feedthru pin to expose the portion of the feedthru pin; and coupling a connector assembly to the exposed portion of the feedthru pin after the electronic assembly has been encapsulated with the non-metallic hermetic composite. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An implantable medical device, comprising:
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an electronic assembly comprising a circuit board and one or more electronic components mounted to the circuit board; a feedthru pin electrically coupled to the electronic assembly; a non-metallic hermetic composite encapsulating the electronic assembly, wherein at least a portion of the feedthru pin is not encapsulated by the non-metallic hermetic composite; a connector assembly coupled to the at least a portion of the feedthru pin; and a layer of impact resistant epoxy disposed over the electronic assembly and connector assembly. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of forming an implantable medical device, comprising:
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providing an electronic assembly comprising a circuit board and one or more electronic components mounted on the circuit board; electrically coupling a feedthru pin to the electronic assembly; encapsulating the electronic assembly with a non-metallic hermetic composite to seal the electronic assembly from a body environment, wherein at least a portion of the feedthru pin is exposed; coupling a connector assembly to the exposed portion of the feedthru pin after the electronic assembly has been encapsulated with the non-metallic hermetic composite; and applying a layer of impact resistant epoxy to the electronic assembly and connector assembly after encapsulating the electronic assembly with the non-metallic hermetic composite. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26)
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Specification