Method for packing a display device and the device obtained thereof

• US 7,746,539 B2
• Filed: 06/25/2008
• Issued: 06/29/2010
• Est. Priority Date: 06/25/2008
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Sampsell, Jeffrey B.
• Primary Examiner(s): Sugarman; Scott J
• Assistant Examiner(s): PINKNEY, DAWAYNE
• Application Number:
  US12/146,388
• Publication Number:
  US 20090323165A1
• Time in Patent Office: 734 Days
• Field of Search: 359290-292, 359/295, 359223-224, 359/298, 359197-198, 359301-303, 359/237, 359/242, 359/245, 359317-318
• US Class Current: 359/290
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81C 1/00317 Packaging optical devices
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: B81C 2203/051 Active alignment, e.g. using internal or external actuators, magnets, sensors, marks or marks detectors
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G09G 3/3466 based on interferometric effect
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

A method for packaging a display device and the device obtained thereof are disclosed. In one aspect, the method comprises providing a substrate. The method further comprises manufacturing an array of display elements on a back side of the substrate, the array comprising a plurality of posts between the display elements connecting electrodes of the display elements. The method further comprises providing a back plate. The method further comprises sealing the back plate to the back side of the substrate, wherein one or more posts are in contact with the back plate after sealing the back plate to the back side of the substrate.

Claims

1. A method of packaging a display device, comprising:

providing a transparent substrate having a front side and a back side;

manufacturing an array of display elements on the back side of the substrate, the array configured to modulate light received through the substrate, the array comprising a plurality of posts that are positioned between display elements in the array and connected to electrodes of the display elements;

providing a back plate; and

sealing the back plate to the back side of the substrate, wherein one or more posts are in contact with the back plate and connect the back plate to the back side of the substrate after sealing the back plate to the back side of the substrate.

2. The method of claim 1, wherein each display element comprises a MEMS display element.

3. The method of claim 2, wherein each MEMS display element comprises an interferometric modulator.

4. The method of claim 3, wherein each interferometric modulator comprises:

a cavity defined by a fixed first layer deposited on the substrate and a movable second layer connected to the substrate, each of the first and second layer comprising an electrode;

wherein light incident on each interferometric modulator is interferometrically modulated by the first and second layer.

5. The method of claim 4, wherein the second layer is movable between a first and a second position.

6. The method of claim 5, wherein each interferometric modulator is configured to transmit or absorb a substantial amount of visible light while the second layer is in the second position.

7. The method of claim 5, wherein each interferometric modulator is configured to reflect light of a particular wavelength range while the second layer is in the first position.

8. A display device packaged by the method of claim 1.

9. A method of packaging a display device, comprising:

providing a transparent substrate having a front side and a back side;

manufacturing an array of display elements on a back side of the substrate, the array configured to modulate light received through the substrate, the array comprising landing areas, the array further comprising a plurality of posts that are positioned between display elements in the array and connected to electrodes of the display elements;

providing a back plate comprising a plurality of support posts; and

sealing the back plate to the back side of the substrate by aligning and connecting a portion of the support posts with the landing areas.

10. The method of claim 9, wherein each display element comprises a MEMS display element.

11. The method of claim 10, wherein the support posts are substantially the same.

12. The method of claim 10, wherein the support posts are taller than the height of the plurality of posts on the array such that the plurality of posts on the array are not in contact with the back plate after the back plate is sealed to the substrate.

13. The method of claim 10, wherein each landing area is formed as a hole, and wherein the sealing of the back plate to the back side of the substrate comprises placing the support posts into the landing area holes.

14. A display device packaged by the method of claim 9.

15. A method of packaging a display device, comprising:

providing a transparent substrate having a front side and a back side;

manufacturing an array of display elements on a back side of the substrate, the array configured to modulate light received through the substrate, the array comprising a plurality of support posts and further comprising a plurality of connection posts positioned between the display elements in the array and connected to electrodes of the display elements;

providing a back plate; and

sealing the back plate to the back side of the substrate by connecting the back plate to the support posts.

16. The method of claim 15, wherein each display element comprises a MEMS display element.

17. The method of claim 16, wherein the support posts are substantially the same.

18. The method of claim 16, wherein the support posts are higher than the connection posts such that the connection posts on the array are not in contact with the back plate when the back plate is sealed to the back side of the substrate.

19. A display device packaged by the method of claim 15.

20. A display device, comprising:

a front panel comprising

a transparent substrate;

an array of display elements disposed on a back side of the substrate, the array configured to modulate light received through the substrate, the array comprising a plurality of posts disposed between the display elements and connected to electrodes of the display elements; and

a back plate sealed to the back side of the substrate and in contact with at least one of the plurality of posts.

21. A display device, comprising:

a front panel comprising an array of display elements disposed on a back side of a substrate, the array comprising landing areas between the display elements of the array, and the array further comprising a plurality of posts located between the display elements and connected to electrodes of the display elements; and

a back plate sealed to the back side of the substrate, the back plate comprising a plurality of support posts,

wherein at least one of the support posts is in contact with one of the landing areas.

22. The device of claim 21, wherein each display element comprises a MEMS display element.

23. The device of claim 22, wherein the support posts align with the landing areas.

24. The device of claim 22, wherein the support posts are substantially the same.

25. The device of claim 22, wherein the support posts are of a height such that the posts on the array are not in contact with the back plate.

26. The device of claim 22, wherein each landing area is formed as a hole, wherein the support posts are dropped into the holes of the landing areas.

27. A display device, comprising:

a front panel comprising an array of display elements located on a back side of a transparent substrate, the array configured to modulate light received through the substrate, the array comprising a plurality of support posts between the display elements and a plurality of connection posts between the display elements and connected to electrodes of the display elements; and

a back plate sealed to the back side of the substrate,

wherein at least one of the support posts is in contact with the back plate.

28. The device of claim 27, wherein each display element comprises a MEMS display element.

29. The device of claim 28, wherein the support posts are substantially the same.

30. The device of claim 28, wherein the support posts higher than the connection posts such that the connection posts on the array are not in contact with the back plate.

31. The device of claim 28, further comprising:

a display;

a processor that is configured to communicate with said display, said processor being configured to process image data; and

a memory device that is configured to communicate with said processor.

32. The device of claim 31, further comprising a driver circuit configured to send at least one signal to the display.

33. The device of claim 32, further comprising a controller configured to send at least a portion of the image data to the driver circuit.

34. The device of claim 31, further comprising an image source module configured to send said image data to said processor.

35. The device of claim 34, wherein the image source module comprises at least one of a receiver, transceiver, and transmitter.

36. The device of claim 31, further comprising an input device configured to receive input data and to communicate said input data to said processor.

37. A display device, comprising:

means for modulating light;

a transparent substrate, wherein the modulating means is configured to modulate light that is received through the transparent substrate;

means for enclosing the modulating means to form a package; and

means for supporting the enclosing means, the supporting means connecting the enclosing means to the substrate at a plurality of locations such that the enclosing means does not touch the modulating means, joined to the supporting means to form a package.

38. The device of claim 37, wherein the modulating means comprises an array of interferometric modulators.

39. The device of claim 37, wherein the enclosing means comprises a back plate.

40. The device of claim 38, wherein the supporting means comprises a plurality of support posts on the enclosing means, the support posts being aligned to landing areas on the substrate between the interferometric modulators.

41. The device of claim 38, wherein the supporting means comprises a plurality of posts between the interferometric modulators.

42. The device of claim 41, wherein the plurality of posts are configured to be connected to electrodes of the interferometric modulators.