Semiconductor light emitting device mounting substrates including a conductive lead extending therein
First Claim
1. A mounting substrate for a semiconductor light emitting device comprising:
- a thermally conductive mounting block having in a first face thereof a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity; and
an electrically conductive lead inserted in the mounting block and extending into the cavity, the conductive lead being electrically isolated from the mounting block and having an exposed contact portion in the cavity, wherein the mounting block includes a channel and/or passageway extending inwardly to the cavity from a side face of the mounting block and wherein the conductive lead is mounted in the channel and/or passageway;
wherein;
the mounting block includes a second face opposing the first face and a side face extending between the first and second faces; and
the channel and/or passageway extends through the side face and inwardly through the mounting block to the cavity.
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Accused Products
Abstract
A mounting substrate for a semiconductor light emitting device includes a thermally conductive mounting block. The mounting block has, in a first face thereof, a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity. A conductive lead inserted into the mounting block extends into the cavity. The conductive lead is electrically isolated from the mounting block and has an exposed contact portion in the cavity. The conductive lead may be a plurality of conductive leads each having an exposed contact portion at different locations in the cavity. Related packaging methods also may be provided.
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Citations
39 Claims
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1. A mounting substrate for a semiconductor light emitting device comprising:
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a thermally conductive mounting block having in a first face thereof a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity; and an electrically conductive lead inserted in the mounting block and extending into the cavity, the conductive lead being electrically isolated from the mounting block and having an exposed contact portion in the cavity, wherein the mounting block includes a channel and/or passageway extending inwardly to the cavity from a side face of the mounting block and wherein the conductive lead is mounted in the channel and/or passageway; wherein; the mounting block includes a second face opposing the first face and a side face extending between the first and second faces; and the channel and/or passageway extends through the side face and inwardly through the mounting block to the cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A mounting substrate for a semiconductor light emitting device comprising:
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a thermally conductive mounting block having first and second opposing faces and a side face therebetween, the first face including thereon a mounting surface that is configured to receive a semiconductor light emitting device thereon; an electrically conductive lead extending inwardly from the side face of the mounting block inserted into the mounting block, the conductive lead being electrically isolated from the mounting block and having an exposed contact portion on a surface thereof facing the first face of the mounting block proximate the mounting surface, wherein the mounting block includes a channel and/or passageway extending inwardly to a region proximate the mounting surface from the side face of the mounting block and wherein the conductive lead is mounted in the channel and/or passageway; wherein the channel and/or passageway extends through the side face and inwardly through the mounting block to the region proximate the mounting surface. - View Dependent Claims (37, 38, 39)
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Specification