High density interconnect system having rapid fabrication cycle
First Claim
1. A process, comprising the steps of:
- providing an assembly comprising a substrate having a first surface and a second surface opposite the first surface, a plurality of spring probes on the first surface and extending from the first surface to define a plurality of probe tips, a corresponding plurality of electrical contacts located on the second surface, and electrical connections extending from each of the spring probes to each of the corresponding plurality of electrical contacts;
compressing the probe tips against a flat reference surface, wherein the flat reference surface is parallel to any of the first surface and the second surface of the substrate; and
applying heat to the assembly within an oven, such that the compressed probe tips conform to the flat reference surface in response to the applied heat.
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Accused Products
Abstract
An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.
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Citations
24 Claims
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1. A process, comprising the steps of:
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providing an assembly comprising a substrate having a first surface and a second surface opposite the first surface, a plurality of spring probes on the first surface and extending from the first surface to define a plurality of probe tips, a corresponding plurality of electrical contacts located on the second surface, and electrical connections extending from each of the spring probes to each of the corresponding plurality of electrical contacts; compressing the probe tips against a flat reference surface, wherein the flat reference surface is parallel to any of the first surface and the second surface of the substrate; and applying heat to the assembly within an oven, such that the compressed probe tips conform to the flat reference surface in response to the applied heat. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A process for planarizing an assembly comprising a substrate having a first surface and a second surface opposite the first surface, a plurality of spring probes on the first surface and extending from the first surface to define a plurality of probe tips, a corresponding plurality of electrical contacts located on the second surface, and electrical connections extending from each of the spring probes to each of the corresponding plurality of electrical contacts, the process comprising the steps of:
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compressing the probe tips against a flat reference surface, wherein the flat reference surface is parallel to any of the first surface and the second surface of the substrate; and applying heat to the assembly within an oven, wherein the compressed probe tips conform to the flat reference surface in response to the applied heat. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification