Modular self-capping wide format print assembly

• US 7,891,767 B2
• Filed: 11/06/2007
• Issued: 02/22/2011
• Est. Priority Date: 07/15/1997
• Status: Expired due to Fees

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): Huffman; Julian D
• Application Number:
  US11/936,064
• Publication Number:
  US 20080062221A1
• Time in Patent Office: 1,204 Days
• Field of Search: 347/13, 347/42, 347/49
• US Class Current: 347/42
• CPC Class Codes: B41J 2/155 for line printing
• CPC Class Codes: B41J 2/16585 for paper-width or non-reciprocating print heads
• CPC Class Codes: B41J 29/02 Framework
• CPC Class Codes: B41J 29/38 Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
• CPC Class Codes: B41J 29/393 Devices for controlling or analysing the entire machine ; Controlling or analysing mechanical parameters involving printing of test patterns

Abstract

A wide format print assembly is provided. The print assembly includes a plurality of printhead modules each having a printhead integrated circuit (IC). Each module has a plurality of micro-electromechanical nozzle arrangements on a wafer substrate for operatively ejecting printing fluid onto a print medium. Each module also has a capping device displaceable between a capping position to cap the nozzle arrangements and an operative position where the nozzle arrangements are exposed for printing The modules also have a printed circuit board (PCB) linked to a CMOS drive circuitry layer on the wafer substrate. The print assembly includes a plurality of ink reservoir moldings to supply the printhead modules with printing fluid, and control circuitry for controlling the nozzle arrangements via the printed circuit boards.

Claims

1. A wide format print assembly comprising:

a plurality of printed circuit boards (PCB'"'"'s);

a plurality of printhead modules connected to each of the PCB'"'"'s respectively, each printhead module having a printhead integrated circuit (IC) comprising a plurality of micro-electromechanical nozzle arrangements on a wafer substrate for operatively ejecting printing fluid onto a print medium, the micro-electromechanical nozzle arrangements on all the printhead modules defining a print zone in which the micro-electromechanical nozzle arrangements are capable of simultaneously ejecting printing fluid onto the print medium, the print zone extending at least 38.4 inches transverse to print medium feed direction;

a capping device for each of the printhead modules respectively, each of the capping devices being displaceable between a capping position to cap the nozzle arrangements and an uncapping position where the nozzle arrangements are exposed for printing;

wherein, each of the PCB'"'"'s has at least one print engine controller for receiving print data for the printhead IC'"'"'s corresponding to the PCB, the at least one print engine controller being configured to synchronize with the print engine controllers on the other PCB'"'"'s.

2. The print assembly of claim 1, wherein the printhead ICs together include at least one hundred thousand nozzle arrangements.

3. The print assembly of claim 2, wherein the printhead ICs together include at least two hundred thousand nozzle arrangements.

4. The print assembly of claim 1, having between forty and one hundred printhead ICs.

5. The print assembly of claim 1, having a camshaft interconnecting the capping devices via a translating member, so that rotational movement of the camshaft results in reciprocal movement of the capping devices between their capping and uncapping positions.

6. The printhead assembly of claim 1, wherein each of the printhead IC'"'"'s has CMOS drive circuitry on the wafer substrate for operating the micro-electromechanical nozzles, the at least one print engine controller on each of the PCB'"'"'s being linked to the CMOS drive circuitry.

7. The printhead assembly of claim 6, in which the print engine controllers on each of the PCB'"'"'s are configured to drive the micro-electromechanical nozzles at a cyclical rate of up to 80 Hz.