Method for manufacturing electroconductive material-filled throughhole substrate
First Claim
1. A method for manufacturing an electroconductive material-filled throughhole substrate of which the front side and back side have been electrically conducted to each other through an electroconductive material filled into the throughholes comprising the steps of:
- forming an electroconductive base layer on one side of a core substrate having throughholes, wherein the electroconductive base layer has an opening corresponding to the throughholes; and
filling the throughholes with an electroconductive material by electroplating using the electroconductive base layer as a seed layer;
wherein the electroconductive material is precipitated on the electroconductive base layer and further, the electroconductive material is precipitated in the openings to clog the openings at a clog site, and then the electroconductive material is precipitated and grown from the clog site toward the inside of the throughholes to fill the electroconductive material into the throughholes.
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Accused Products
Abstract
Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.
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Citations
7 Claims
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1. A method for manufacturing an electroconductive material-filled throughhole substrate of which the front side and back side have been electrically conducted to each other through an electroconductive material filled into the throughholes comprising the steps of:
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forming an electroconductive base layer on one side of a core substrate having throughholes, wherein the electroconductive base layer has an opening corresponding to the throughholes; and filling the throughholes with an electroconductive material by electroplating using the electroconductive base layer as a seed layer; wherein the electroconductive material is precipitated on the electroconductive base layer and further, the electroconductive material is precipitated in the openings to clog the openings at a clog site, and then the electroconductive material is precipitated and grown from the clog site toward the inside of the throughholes to fill the electroconductive material into the throughholes. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification