Method and device for providing electronic circuitry on a backplate
First Claim
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1. A method of fabricating a display, comprising:
- providing a transparent substrate comprising an array of interferometric modulators on a first surface of the transparent substrate, wherein said modulators comprise reflective elements;
providing a backplate having a first surface;
forming electronic circuitry on the first surface of the backplate, wherein the electronic circuitry comprises an application-specific integrated circuit (ASIC), and wherein the electronic circuitry is configured to control the state of said reflective elements; and
positioning the transparent substrate and the backplate such that at least a portion of the transparent substrate is spaced apart from at least a portion of the backplate by a cavity and the first surface of the transparent substrate is located proximal the first surface of the backplate and the electronic circuitry is placed in electrical connection with the array of interferometric modulators.
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Abstract
A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate may contain electronic circuitry fabricated on the backplane. The electronic circuitry is placed in electrical communication with the array of interferometric modulators and is configured to control the state of the array of interferometric modulators.
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Citations
17 Claims
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1. A method of fabricating a display, comprising:
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providing a transparent substrate comprising an array of interferometric modulators on a first surface of the transparent substrate, wherein said modulators comprise reflective elements; providing a backplate having a first surface; forming electronic circuitry on the first surface of the backplate, wherein the electronic circuitry comprises an application-specific integrated circuit (ASIC), and wherein the electronic circuitry is configured to control the state of said reflective elements; and positioning the transparent substrate and the backplate such that at least a portion of the transparent substrate is spaced apart from at least a portion of the backplate by a cavity and the first surface of the transparent substrate is located proximal the first surface of the backplate and the electronic circuitry is placed in electrical connection with the array of interferometric modulators. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A process of manufacturing a display comprising:
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providing a transparent substrate having a first surface; forming an array of interferometric modulators on the first surface of the transparent substrate, wherein said modulators comprise reflective elements; providing a backplate having a first surface; forming electronic circuitry on the first surface of the backplate, wherein forming electronic circuitry on the first surface of the transparent substrate comprises forming an application-specific integrated circuit comprising a silicon layer, and wherein the electronic circuitry is configured to control the state said reflective elements; and positioning the transparent substrate and the backplate such that at least a portion of the transparent substrate is spaced apart from at least a portion of the backplate by a cavity and the first surface of the transparent substrate is located proximal the first surface of the backplate and the electronic circuitry is placed in electrical connection with the array of interferometric modulators. - View Dependent Claims (17)
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Specification