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Apparatus and method for reducing slippage between structures in an interferometric modulator

  • US 7,948,671 B2
  • Filed: 12/04/2009
  • Issued: 05/24/2011
  • Est. Priority Date: 09/27/2004
  • Status: Expired due to Fees
First Claim
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1. A method of making an electromechanical device, the method comprising:

  • forming a substrate layer, the substrate layer comprising a first reflective surface;

    etching at least a portion of a support region of the substrate layer to form a roughened support region; and

    forming a support structure on the roughened support region of the substrate layer;

    the roughened support region being configured to increase adhesion between the substrate layer and the support structure.

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