Light emitting device

• US 7,964,943 B2
• Filed: 12/19/2008
• Issued: 06/21/2011
• Est. Priority Date: 11/18/2008
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Cho, Jae Ho, Seo, Eun Jung, Kim, Bang Hyun
• Primary Examiner(s): Dickey; Thomas L
• Assistant Examiner(s): YUSHIN, NIKOLAY K
• Application Number:
  US12/339,665
• Publication Number:
  US 20100123156A1
• Time in Patent Office: 914 Days
• Field of Search: 257/98, 257/99, 257/675, 257/E33.059, 257/666, 257/676, 257/79
• US Class Current: 257/676
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.

Claims

1. A light emitting device comprising:

a plurality of lead frame units spaced apart from each other, each of the lead frame units having a top surface, an opposing bottom surface, and side walls disposed between the top surface and the bottom surface, wherein the sidewalls are inset, so as to undercut the to surface and at least partially define a fixing space;

a light emitting diode chip mounted on the top surface of one of the lead frame units; and

a molding unit that is disposed on the top surfaces of the lead frame units, covers the light emitting diode chip, and extends into the fixing spaces.

2. The light emitting device of claim 1, wherein the bottom surfaces have a smaller surface area than the top surfaces.

3. The light emitting device of claim 1, wherein the sidewalls form a stepped structure.

4. The light emitting device of claim 1, wherein at least one of the sidewalls is inclined, such that the corresponding bottom surface has a smaller surface area than the corresponding to surface.

5. The light emitting device of claim 1, further comprising a reflector formed on top surfaces of the lead frame units and surrounding the light emitting diode chip.

6. The light emitting device of claim 1, wherein the molding unit comprises a phosphor to alter a wavelength of light emitted from the light emitting diode chip.

7. The light emitting device of claim 1, wherein one of the lead frame units comprises a fixing hole that extends between the bottom and top surfaces and is not connected to the fixing space.

8. The light emitting device of claim 1, wherein the lead frame units have fixing holes that extend from the top surfaces to the fixing spaces.

9. The light emitting device of claim 8, wherein the sidewalls form a stepped structure.

10. The light emitting device of claim 8, wherein the sidewalls are inclined.

11. A light emitting device comprising:

a plurality of lead frame units spaced apart from each other, each of the lead frame units having a top surface, an opposing bottom surface, and side walls disposed between the top and bottom surfaces, along three edges of the lead frame unit, the sidewalls being inset so as to undercut the top surface and least partially define a fixing space;

a light emitting diode chip mounted on the tops surface of one of the lead frame units; and

a molding unit that is disposed on the top surfaces of the lead frame units, covers the light emitting diode chip, and extends into the fixing spaces.

12. The light emitting device of claim 11, wherein the lead frame units have fixing holes that extend from the top surfaces to the fixing spaces.

13. The light emitting device of claim 11, wherein the sidewalls form a stepped structure.

14. The light emitting device of claim 11, wherein the bottom surfaces have a smaller surface area than the top surfaces.

15. The light emitting device of claim 11, wherein the sidewalls are inclined, such that the bottom surfaces have a smaller surface area than the top surfaces.