Chip antenna apparatus and methods

• US 7,973,720 B2
• Filed: 03/15/2010
• Issued: 07/05/2011
• Est. Priority Date: 06/28/2004
• Status: Active Grant

• Current Assignee: Cantor Fitzgerald Securities (Cantor Fitzgerald, L.P.)
• Original Assignee: LKP Pulse Finland OY
• Inventors: Sorvala, Juha
• Primary Examiner(s): PHAN, THO GIA
• Application Number:
  US12/661,394
• Publication Number:
  US 20100176998A1
• Time in Patent Office: 477 Days
• Field of Search: 343/700, 343/702, 343/829, 343/846
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 9/0421 with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence

Abstract

A chip component with dielectric substrate and plurality of radiating antenna elements on the surface thereof. In one embodiment, two (2) substantially symmetric elements are used, each covering an opposite head and upper surface portion of the device. The surface between the elements comprises a slot. The chip is mounted on a circuit board (e.g., PCB) whose conductor pattern is part of the antenna. No ground plane is used under the chip or its sides to a certain distance. One of the antenna elements is coupled to the feed conductor on the PCB and to the ground plane, while the parasitic element is coupled only to the ground plane. The parasitic element is fed through coupling over the slot, and both elements resonate at the operating frequency. The antenna can be tuned and matched without discrete components, is substantially omni-directional, and has low substrate losses due to simple field image.

Claims

1. Antenna apparatus, comprising:

a dielectric substrate comprising a plurality of surfaces;

a ground plane;

a first antenna element disposed at least partially on a first surface of the dielectric substrate and at least partially on a second surface of the dielectric substrate, the first antenna element configured to be coupled to the ground plane at a first location;

a second antenna element disposed at least partially on a third surface of the dielectric substrate, the third surface and the first surface being disposed substantially at opposite ends of the substrate, and at least partially on the second surface, the second antenna element configured to be coupled to the ground plane at a second location; and

an electromagnetic coupling element disposed substantially between the first element and the second element;

wherein the first antenna element is configured to be galvanically coupled to a feed structure at a third location; and

wherein the second antenna element is configured to be electromagnetically coupled to the feed structure through the electromagnetic coupling element so as to form a resonant structure between the first antenna element, the second antenna element, the dielectric substrate, and the ground plane.

2. The antenna apparatus of claim 1, wherein the ground plane is disposed a first predetermined distance away from the dielectric substrate along at least a portion of a fourth surface and along at least a portion of a fifth surface of the dielectric substrate, said fifth surface substantially opposing said fourth surface.

3. The antenna apparatus of claim 2, wherein the ground plane is further disposed:

(i) a second predetermined distance away from the dielectric substrate along at least a portion of the first surface; and

(ii) a third predetermined distance away from the dielectric substrate along at least a portion of the third surface.

4. The antenna apparatus of claim 2, wherein the first and the third locations are disposed proximate a first and a second corner of the dielectric substrate, respectively, said first and said second corner arranged along a first edge of the dielectric substrate.

5. The antenna apparatus of claim 4, wherein the second location is disposed proximate a third corner of the dielectric substrate, said third corner arranged along a second edge of the dielectric substrate, said second edge substantially opposing said first edge.

6. The antenna apparatus of claim 1, wherein the second antenna element is further configured to be coupled to the ground plane at a fourth location, said fourth location positioned distally relative to the electromagnetic coupling element.

7. The antenna apparatus of claim 6, wherein:

the first and the third locations are disposed proximate a first and a second corner of the dielectric substrate, respectively;

the second and the fourth locations are disposed proximate a third and a fourth corner of the dielectric substrate, respectively;

said first and said second corner arranged along a first edge of the dielectric substrate; and

said third and said fourth corner are arranged along a second edge of the dielectric substrate, said second edge opposing said first edge.

8. A chip component, comprising:

a dielectric substrate comprising a plurality of surfaces;

a first antenna element disposed at least partially on a first, a second and a third surface of said substrate, the first antenna element adapted to couple to a ground plane at a first location;

a second antenna element disposed at least partially on the first surface of said substrate, and at least partially on the third surface of said substrate, the second antenna element adapted to couple to the ground plane at a second location; and

an electromagnetic coupling element disposed substantially between the first antenna element and the second antenna element and configured to electromagnetically couple the second antenna element to the first antenna element;

wherein the first antenna element is configured to be galvanically coupled to a feed structure at a third location, said galvanic coupling comprising a conductive material asymmetrically coupled to the third surface to provide a substantially omni-directional radiation pattern within at least a first frequency range.

9. The chip component of claim 8, wherein the second antenna element is disposed at least partially on the second surface, and is further configured to be coupled to the ground plane at a fourth location.

10. The chip component of claim 9, wherein:

the first antenna element is disposed at least partially on the fourth surface of the dielectric substrate; and

the second antenna element is disposed at least partially on a fifth surface of the dielectric substrate, the fifth surface substantially opposing the fourth surface.

11. The chip component of claim 10, wherein:

the second and the fourth surface share a common first edge;

the third and the fourth surface share a common second edge;

the third and the fifth surface share a common third edge;

the second and the fifth surface share a common fourth edge;

the first antenna element is disposed over a first area proximate said first edge and said second edge; and

the second antenna element is disposed over a third area proximate said third edge and said fourth edge.

12. The chip component of claim 11, wherein:

the first location is proximate the first edge;

the second location is proximate the third edge;

the third location is proximate the second edge; and

the fourth location is proximate the fourth edge.

13. The chip component of claim 8, wherein the electromagnetic coupling element comprises a substantially linear slot positioned on the second surface.

14. The chip component of claim 8, wherein the electromagnetic coupling element comprises a slot comprised of at least one turn.

15. The chip component of claim 14, wherein the at least one turn forms at least one finger-like projection extending between respective open ends of the first antenna element and the second antenna element.

16. The chip component of claim 8, wherein:

the first antenna element is disposed at least partially on a fourth surface of the dielectric substrate; and

the second antenna element is disposed at least partially on a fifth surface of the dielectric substrate, the fifth surface substantially opposing the fourth surface.

17. The chip component of claim 16, wherein:

the second and the fourth surface share a common first edge;

the second and the fifth surface share a common second edge;

the first antenna element is disposed over an area proximate said first edge; and

the second antenna element is disposed over an area proximate said second edge.

18. An antenna apparatus, comprising:

a dielectric substrate comprising a plurality of surfaces;

a ground plane;

a first antenna element disposed at least partially on a first surface of the dielectric substrate and at least partially on a second surface of the dielectric substrate, the first antenna element configured to be coupled to the ground plane at a first location;

a second antenna element disposed at least partially on a third surface of the dielectric substrate, the third surface substantially opposing the first surface, and at least partially on the second surface, the second antenna element configured to be coupled to the ground plane at a second location; and

an electromagnetic coupling element disposed substantially between at least portions of the first element and the second element;

wherein the ground plane is arranged a first predetermined distance away from the dielectric substrate along at least a portion of a fourth surface of the dielectric substrate; and

wherein a feed structure is galvanically coupled to the first antenna element at a third location, and is coupled to the second antenna element through the electromagnetic coupling element so as to form a resonant structure between the first antenna element, the second antenna element, the dielectric substrate, and the ground plane.

19. The antenna apparatus of claim 18, wherein the ground plane is further disposed the first predetermined distance away from the dielectric substrate along at least a portion of a fifth surface, said fifth surface arranged substantially opposing said fourth surface.

20. The antenna apparatus of claim 19, wherein the ground plane is further disposed a second predetermined distance away from the dielectric substrate along at least a portion of the first surface and along at least a portion of the third surface of the dielectric substrate.

21. The antenna apparatus of claim 18, wherein the electromagnetic coupling element comprises an open slot configured substantially between open ends of the first and the second antenna elements.

22. The antenna apparatus of claim 21, wherein the first and the second locations are positioned distally relative to the electromagnetic coupling element.

23. The antenna apparatus of claim 18, wherein the first and the third location are disposed proximate to an edge of the first surface, and the second location is disposed proximate to an edge of the third surface.

24. The antenna apparatus of claim 18, wherein:

the ground plane is coupled to the first surface at the first location and to the third surface at the second location; and

the first and the second locations are positioned distally relative to the electromagnetic coupling element.

25. The antenna apparatus of claim 18, wherein at least one of the first or the second antenna elements is formed at least partially on a fourth surface of the dielectric substrate.

26. The antenna apparatus of claim 25, wherein at least one of the first and/or the second antenna elements is formed at least partially on a fifth surface of the dielectric substrate;

the fifth surface substantially opposing the fourth surface.

27. The antenna apparatus of claim 18, wherein at least one of the first or second antenna elements is formed at least partially on a sixth surface of the dielectric substrate.

28. The antenna apparatus of claim 18, wherein the second antenna element is further configured to be coupled to the ground plane at a fourth location, said second, said first, and said fourth location positioned distally relative to the electromagnetic coupling element.

29. A chip component, comprising:

a first layer comprising a ground plane;

a second layer having a first end and a second end, the second layer being disposed substantially parallel to the first layer and comprising a conductive element, the conductive element comprising;

a first antenna element coupled to the ground plane at a first location proximate the first end;

a second antenna element coupled to the ground plane at a second location proximate the second end; and

an electromagnetic coupling element disposed between the first antenna element and the second antenna element;

a dielectric substrate, disposed substantially between the first and the second layer;

a first and a second interconnect structure configured to couple the first layer to the first and second ends of the second layer, respectively; and

a feed structure coupled to the first antenna element at a third location and coupled to the second antenna element through the electromagnetic coupling element so as to form a resonant structure between the first antenna element, the second antenna element, the dielectric substrate, and the ground plane;

wherein the first antenna element is disposed at least partially on the first interconnect structure, and the second antenna element is disposed at least partially on the second interconnect structure.