Tamperproof RFID component integrated into a multilayer printed circuit board

• US 8,072,326 B2
• Filed: 12/28/2006
• Issued: 12/06/2011
• Est. Priority Date: 06/29/2005
• Status: Expired due to Fees

• Current Assignee: LYNC Circuits Limited
• Original Assignee: Martin Cotton
• Inventors: Cotton, Martin
• Primary Examiner(s): HOFSASS, JEFFERY A
• Application Number:
  US11/646,627
• Publication Number:
  US 20070171078A1
• Time in Patent Office: 1,804 Days
• Field of Search: 340/572.1, 340/572.7, 340/572.8, 340/10.1, 340/539.1, 340/539.31
• US Class Current: 340/572.1
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs

Abstract

An electronic device comprising an RFID component which can act in an active mode and a passive mode. Preferably the electronic device is a PCB and the RFID component is at least partially located in the PCB. More preferably, the RFID component is located within the PCB. An electronic device comprising an embedded active component is disclosed. A method of exchanging information within an electronic device is disclosed comprising the steps in providing an electronic device which contains an RFID component which connect in a active and a passive mode, and a remote RFID device, and exchanging information between the RFID component and the remote RFID device.

Claims

1. A substantially flat and rigid multilayer printed circuit board (PCB) having a tamper-proof RFID component, comprising:

a radio frequency identification device (RFID) component comprising an electronic core and an antenna;

wherein at least the electronic core of the RFID component is integrated into the multilayer PCB to render the electronic core tamper proof.

2. The multilayer PCB of claim 1, wherein both the electronic core and the antenna are integrated into the at least one layer of the multilayer PCB.

3. The multilayer PCB of claim 1, wherein:

the RFID component is operable to act in an active mode when powered by electrical energy supplied through the multilayer PCB; and

the RFID component is further operable to act in a passive mode when not powered by electrical energy supplied through the multilayer PCB.

4. The multilayer PCB of claim 1, wherein the RFID component is electronically connected to said at least one a layer of the multilayer PCB.

5. The multilayer PCB of claim 4, wherein:

the RFID component comprises an antenna;

the RFID component is operable to act in an active mode when powered by electrical energy supplied through the multilayer PCB; and

the RFID component is further operable to act in a passive mode when not powered by electrical energy supplied through the multilayer PCB.

6. The multilayer PCB of claim 4, wherein the antenna comprises metal.

7. The multilayer PCB of claim 4, wherein the antenna comprises copper, platinum, silver, gold, tin or aluminum.

8. The multilayer PCB of claim 4, wherein the antenna comprises conductive polymer, conductive ink and/or conductive plastics.

9. The multilayer PCB of claim 1, wherein the RFID component is operable to transmit and receive information.

10. A method of making a multilayer PCB, comprising the steps of:

providing a radio frequency identification device (RFID) component comprising an electronic core and an antenna positioned on a substantially flat and rigid multilayer PCB; and

integrating at least the electronic core of the RFID component into at least one layer of the multilayer PCB to render the electronic core tamper proof.

11. The method of claim 10, further comprising the steps of:

configuring the RFID component to be operable to act in an active mode when powered by electrical energy supplied through the multilayer PCB; and

further configuring the RFID component to be operable to act in a passive mode when not powered by electrical energy supplied through the multilayer PCB.