Method and system for forming an electronic assembly having inertial sensors mounted thereto

• US 8,100,010 B2
• Filed: 04/14/2008
• Issued: 01/24/2012
• Est. Priority Date: 04/14/2008
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Fly, Brian E., Moya, Dave
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US12/102,508
• Publication Number:
  US 20090255335A1
• Time in Patent Office: 1,380 Days
• Field of Search: 734/93, 735/040.4, 735/041.2, 735/10, 735/140.1, 735/143.5
• US Class Current: 73/493
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis
• CPC Class Codes: G01C 21/166 Mechanical, construction or arrangement details of inertial navigation systems
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/0831 the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration

Abstract

Systems and methods for forming an electronic assembly are provided. A first inertial sensor having a first sense axis is attached to a bracket. A second inertial sensor having a second sense axis is attached to the bracket such that the second sense axis is substantially orthogonal to the first sense axis. The bracket is attached to a circuit board having at least one microelectronic device mounted thereto.

Claims

1. An inertial measurement unit comprising:

a circuit board;

a plurality of conductive traces formed on the circuit board;

an integrated circuit mounted to the circuit board and electrically connected to the conductive traces; and

a sensor assembly comprising;

a bracket connected to the circuit board, the bracket including a first side plate, a second side plate, and a third side plate, the first, second, and third side plates orthogonally disposed and coupled to each other, the first, second, and third side plates each having an outer side and an inner side;

a first sensor-subassembly mounted to the outer side of the first side plate, the first sensor-subassembly comprising a first inertial sensor having a first sense axis and a second inertial sensor having a second sense axis that is orthogonal to the first sense axis;

a second sensor-subassembly mounted to the outer side of the second side plate, the second sensor-subassembly comprising a third inertial sensor having a third sense axis and a fourth inertial sensor having a fourth sense axis that is orthogonal to the third sense axis;

a third sensor-subassembly mounted to the inner side of the third side plate, the third sensor-subassembly comprising a fifth inertial sensor having a fifth sense axis and a sixth inertial sensor having a sixth sense axis that is orthogonal to the fifth sense axis;

a first plurality of conductive leads electrically connected to the first and second inertial sensors and to a first plurality of the conductive traces such that the first and second inertial sensors are in operable communication with the integrated circuit;

a second plurality of conductive leads electrically connected to the third and fourth inertial sensors and to a second plurality of the conductive traces such that the third and fourth inertial sensors are in operable communication with the integrated circuit; and

a third plurality of conductive leads electrically connected to the fifth and sixth inertial sensors and to a third plurality of the conductive traces such that the fifth and sixth inertial sensors are in operable communication with the integrated circuit,

wherein the first, second, and third plurality of the conductive traces each have first portions adjacent the integrated circuit and second portions adjacent the bracket, and wherein the sensor assembly further comprises;

a first flex-tape having the first plurality of conductive leads embedded therein, the first flex-tape having a first portion coupled between the first and second inertial sensors and a second portion coupled to the second portions of the first plurality of conductive traces;

a second flex-tape having the second plurality of conductive leads embedded therein, the second flex-tape having a first portion coupled between the third and fourth inertial sensors and a second portion coupled to the second portions of the second plurality of conductive traces; and

a third flex-tape having the third plurality of conductive leads embedded therein, the third flex-tape having a first portion coupled between the fifth and sixth inertial sensors and a second portion coupled to the second portions of the third plurality of conductive traces.

2. The inertial measurement unit of claim 1, wherein:

the first, third, and fifth inertial sensors are micro-electromechanical system (MEMS) gyroscopes; and

the second, fourth, and six inertial sensors are MEMS accelerometers.

3. The inertial measurement unit of claim 1, wherein:

the first, third, and fifth measurement axes are mutually orthogonal; and

the second, fourth, and sixth measurement axes are mutually orthogonal.