Vertical topology light emitting device using a conductive support structure

• US 8,106,417 B2
• Filed: 10/08/2008
• Issued: 01/31/2012
• Est. Priority Date: 04/09/2002
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Electronics, Inc. (LG Corporation)
• Inventors: Yoo, Myung Cheol
• Primary Examiner(s): Vu, David
• Assistant Examiner(s): NGUYEN, DUY T V
• Application Number:
  US12/285,557
• Publication Number:
  US 20090072264A1
• Time in Patent Office: 1,210 Days
• Field of Search: 257 79-103, 257/13
• US Class Current: 257/99
• CPC Class Codes: H01L 33/007 comprising nitride compounds
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/04 with a quantum effect structure or superlattice, e.g. tunnel junction
• CPC Class Codes: H01L 33/12 with a stress relaxation structure, e.g. buffer layer
• CPC Class Codes: H01L 33/14 with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/42 Transparent materials
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A method of fabricating semiconductor devices, such as GaN LEDs, on insulating substrates, such as sapphire. Semiconductor layers are produced on the insulating substrate using normal techniques. Trenches that define the boundaries of the individual devices are formed through the semiconductor layers and into the insulating substrate, beneficially by inductive coupled plasma reactive ion etching. A first support structure is attached to the semiconductor layers. The hard substrate is then removed, beneficially by laser lift off. A second supporting structure, preferably conductive, is substituted for the hard substrate and the first supporting structure is removed. Individual devices are then diced, beneficially by etching through the second supporting structure. A protective photo-resist layer can protect the semiconductor layers from the attachment of the first support structure. A conductive bottom contact (possibly reflective) can be inserted between the second supporting structure and the semiconductor layers.

Claims

1. A vertical topology light emitting device, comprising:

a semiconductive device having a first surface, a second surface and a light emitting layer, the semiconductive device comprises a first-type GaN-based layer, an active layer, and a second-type GaN-based layer;

a first electrode on the first surface of the semiconductive device;

a reflective structure on the second surface of the semiconductive device, wherein the reflective structure serves as a second electrode to the semiconductive device, wherein the reflective structure reflects light from the semiconductive device back through the first surface of the semiconductive device, wherein the reflective structure comprises a metal contact on the second surface of the semiconductor device and a reflective metal layer directly on the metal contact, wherein the reflective metal layer is thicker than the metal contact, wherein the metal contact is a pure metal and directly contacts the first-type GaN-based layer, and wherein the reflective metal layer and the metal contact comprise different materials;

a conductive adhesion structure on the reflective structure;

a conductive support structure on the conductive adhesion structure;

a metal contact pad on the first electrode; and

an inter-layer between the first electrode and the metal contact pad, wherein the inter-layer is located over the conductive adhesion structure,

wherein the conductive adhesion structure comprises a first metallic layer and a second metallic layer, wherein the first metallic layer is located proximate to the conductive support structure and the second metallic layer is located proximate to the reflective structure, wherein the first metallic layer comprises Au, and wherein the first metallic layer is thicker than the second metallic layer.

2. The device of claim 1, wherein the reflective structure comprises an aluminum layer.

3. The device of claim 1, wherein the first electrode comprises a transparent layer.

4. The device of claim 3, wherein the transparent layer comprises an oxide.

5. The device of claim 1, wherein the conductive support structure comprises a metallic layer.

6. The device of claim 1, wherein the conductive support structure is less than about 100 microns thick.

7. The device of claim 1, wherein the conductive support structure comprises at least one of Cu, Al, or Au.

8. The device of claim 1, wherein the first metallic layer contacts the conductive support structure.

9. The device of claim 1, wherein the second metallic layer contacts the reflective structure.

10. The device of claim 1, wherein the reflective structure is multilayer, and wherein one layer of the reflective structure comprises aluminum or titanium.

11. The device of claim 1, wherein the metal contact pad comprises at least one of Pd, Pt, Au, or Al.

12. The device of claim 1, wherein the inter-layer is configured to enhance adhesion between the first electrode and the metal contact pad.

13. The device of claim 1, wherein the inter-layer comprises at least one of Cr or Au.

14. The device of claim 1, wherein the conductive support structure is located directly on the conductive adhesion structure.

15. The device of claim 1, wherein the first electrode comprises nickel.

16. The device of claim 1, wherein the thickness of the first metallic layer is less than about 100 nm.

17. The device of claim 1, wherein the second metallic layer comprises Cr.

18. The device of claim 1, wherein the thickness of the second metallic layer is less than about 30 nm.

19. The device of claim 1, wherein the thickness of the semiconductive device is less than 5 microns.

20. The device of claim 1, wherein the reflectivity of the reflective metal layer is higher than the reflectivity of the metal contact.

21. The device of claim 1, wherein the conductive support structure comprises a thermally conductive material.

22. The device of claim 1, wherein the conductive support structure comprises an electrically conductive material.

23. The device of claim 1, wherein the conductive support structure and the conductive adhesion structure have surfaces that face each other, and wherein the areas of the surfaces are substantially the same.

24. The device of claim 23, wherein the conductive support structure and the conductive adhesion structure contact each other.

25. The device of claim 1, wherein the metal contact pad has a diameter of about 100 microns.

26. The device of claim 1, wherein the first electrode contacts the first surface of the semiconductive device.

27. The device of claim 1, wherein the conductive adhesion structure contacts the reflective structure.

28. The device of claim 1, wherein the reflective structure contacts the second surface of the semiconductive device.

29. The device claim 1, wherein the reflective metal layer is a single layer.

30. The device claim 1, wherein the first-type is n-type and the second-type is p-type.