Reprogrammable circuit board with alignment-insensitive support for multiple component contact types

• US 8,124,429 B2
• Filed: 12/15/2006
• Issued: 02/28/2012
• Est. Priority Date: 12/15/2006
• Status: Expired due to Fees

• Current Assignee: Richard Norman
• Original Assignee: Richard Norman
• Inventors: Norman, Richard
• Primary Examiner(s): Lebentritt, Michael
• Application Number:
  US11/611,263
• Publication Number:
  US 20080143379A1
• Time in Patent Office: 1,901 Days
• Field of Search: 438 14- 18, 438 50- 53, 257/E21.526, 257/E23.067, 257/79, 257/171, 257/179, 257/27.081, 257/98, 257102-105, 324/754, 324/761, 324/762
• US Class Current: 438/17
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/5382 Adaptable interconnections, e.g. for engineering changes
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/029 having a programmable lay-out, i.e. adapted for choosing between a few possibilities
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/10212 Programmable component
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53183 Multilead component

Abstract

The present invention is directed to a system that programmably interconnects integrated circuit chips and other components at near-intra-chip density. The system'"'"'s contact structure allows it to adapt to components with a wide variety of contact spacings and interconnection requirements, the use of releasable attachment means allows component placement to be modified as needed, the system identifies the contacts and the components to facilitate specifying the inter-component connections, and the system provides signal conditioning and retiming to minimize issues with signal integrity and signal skew.

Claims

1. A method for manufacturing a multi-chip module comprising a substrate on which a plurality of components can be affixed, wherein the substrate can be electronically programmed to establish signal-conducting interconnections between specified component contacts, the method comprising determining a position of components affixed to the substrate through using contact detection circuitry build into said programmable circuit board, and using said position in programming said signal-conducting interconnections between specified component contacts.

2. A method as claimed in claim 1, wherein said detecting comprises detecting a change in capacitance caused by the proximity of a component contact.

3. A method as claimed in claim 1, wherein said detecting comprises detecting a change in resistance caused by the overlap of a component contact with a plurality of conductive regions on the substrate surface.

4. A method as claimed in claim 3, wherein said detecting comprises determining a degree of overlap of a component contact with a substrate contact.

5. A method as claimed in claim 1, wherein said position of at least one component is compared to a specified position for that component.

6. A method as claimed in claim 5, wherein when the determined position and the specified position of a component differ, the specified position is adjusted until it matches the determined position.

7. A method as claimed in claim 6, wherein the adjustment of said specified position is performed by a program that maintains the specified connectivity of the component to other components as said specified position is adjusted.

8. A method as claimed in claim 6, further comprising communicating the adjusted specified position of said component to a program that is operable to calculate configuration data that would configure said programmable substrate to route the specified interconnections from said component'"'"'s contact to specified other components.

9. A method as claimed in claim 8, further comprising sending said configuration data to said programmable substrate to configure it to interconnect the contacts of said component, in its determined position, to the contacts of specified other components.

10. A method as claimed in claim 9, further comprising identifying the outlines of components from a set of detected component contacts.

11. A method as claimed in claim 10, further comprising identifying components in a components library that match a given identified component outline.

12. A method as claimed in claim 11, further comprising determining whether two contacts of an affixed component have a low-resistance path between them.

13. A method as claimed in claim 12, further comprising determining which sets of contacts of an affixed component have low-resistance paths between them.

14. A method as claimed in claim 13, further comprising identifying components in a components library whose sets of contacts with low resistance paths between them would, if placed on said programmable substrate, match said determined sets of contacts.

15. A method of prototyping a multi-chip system using a programmable circuit board adapted to receive and programmably interconnect a plurality of components, the method comprising automatically recognizing an identity of at least one of said components by probing component contacts on said programmable circuit board.

16. A method as claimed in claim 15, wherein said programmable circuit board has alignment-insensitive micro-contacts for receiving contacts of said components, further comprising automatically discovering which ones of said micro-contacts are in electrical contact with said component contacts, and selectively connecting said micro-contacts to contacts for providing an interconnecting path for said component contacts to other devices.

17. A method as claimed in claim 16, wherein said components are manually placed on said substrate, and said components are operational within said multi-chip system as manually positioned.

18. A method of manufacturing a multi-chip system using a programmable circuit board having alignment-insensitive micro-contacts for receiving contacts of said components and being adapted to receive and programmably interconnect a plurality of components, the method comprising manually placing said components on said substrate without alignment guides, wherein said components are operational within said multi-chip system as manually positioned.

19. A method of manufacturing a multi-chip system using a programmable circuit board having alignment-insensitive contacts for receiving contacts of said components and being adapted to receive and programmably interconnect a plurality of components, without having the positions of said components predetermined, the method comprising automatically discovering, through using contact detection circuitry build into said programmable circuit board, which ones of said programmable circuit board contacts are in electrical contact with said component contacts, and selectively connecting said programmable circuit board contacts to an interconnecting path for said component contacts to other devices.

20. A method as claimed in claim 19, further comprising generating at least a part of interconnect programming data using stored component contact data providing component contact function information for said components.

21. A method as claimed in claim 20, further comprising automatically recognizing an identity of said components by probing component contacts on said programmable circuit board, and using said identity to retrieve component contact data for said components.

22. A method of manufacturing a multi-chip system comprising:

prototyping the multi-chip system using a substrate on which a plurality of components can be affixed, wherein the substrate can be reversibly electronically programmed to establish signal-conducting interconnections between specified component contacts without having those interconnections pass through reprogrammable interconnection components affixed to said substrate;

determining from said prototyping interconnect data defining contacts and interconnects of a production circuit board for said multi-chip system; and

manufacturing said multi-chip system using said production circuit board.