Electronic component module
First Claim
1. An electronic component module comprising:
- a first electronic component which is disposed on a top surface of a substrate;
a second electronic component which has a height lower than that of the first electronic component and is disposed on the top surface of the substrate so as to be side by side with the first electronic component;
a planar top plate which is fixed to the first electronic component so as to cover the first electronic component and the second electronic component; and
a top plate holding member which is disposed between the second electronic component and the top plate so as to hold the top platewherein the top plate has a composite structure including an insulating base material portion, and an electrically conductive foil formed on the base material portion,wherein the top plate further includes an insulating member which covers the electrically conductive foil,wherein the insulating member has an opening portion which exposes a part of the electrically conductive foil, andwherein the top plate is adapted so that the opening portion is disposed on the opposite side to the substrate.
1 Assignment
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Accused Products
Abstract
Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.
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Citations
14 Claims
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1. An electronic component module comprising:
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a first electronic component which is disposed on a top surface of a substrate; a second electronic component which has a height lower than that of the first electronic component and is disposed on the top surface of the substrate so as to be side by side with the first electronic component; a planar top plate which is fixed to the first electronic component so as to cover the first electronic component and the second electronic component; and a top plate holding member which is disposed between the second electronic component and the top plate so as to hold the top plate wherein the top plate has a composite structure including an insulating base material portion, and an electrically conductive foil formed on the base material portion, wherein the top plate further includes an insulating member which covers the electrically conductive foil, wherein the insulating member has an opening portion which exposes a part of the electrically conductive foil, and wherein the top plate is adapted so that the opening portion is disposed on the opposite side to the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification