Analysis method using finite element method, program causing computer to execute same, and system for same

• US 8,229,712 B2
• Filed: 08/17/2009
• Issued: 07/24/2012
• Est. Priority Date: 05/31/2001
• Status: Expired due to Fees

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Hirata, Ichiro
• Primary Examiner(s): Shah, Kamini S
• Assistant Examiner(s): GEBRESILASSIE, KIBROM K
• Application Number:
  US12/461,580
• Publication Number:
  US 20090312991A1
• Time in Patent Office: 1,072 Days
• Field of Search: 703/1, 703/2, 703 6- 8, 700/98, 716/20, 716/119
• US Class Current: 703/1
• CPC Class Codes: G06F 30/23 using finite element methods [FEM] or finite difference methods [FDM]

Abstract

An FEM analysis system is provided which is capable of analyzing with high accuracy and within a short time in a drop shock analysis of electronic devices in which a very small mesh size is incorporated. Processing to be performed by an optimal solution selecting and analyzing section includes a step of checking whether an analysis to be performed is a shock analysis, a step of searching for a minimum mesh size when the analysis to be performed is judged to be a shock analysis, a step of creating a simplified analysis model using the minimum mesh size, a step of performing a preliminary analysis on a simplified model by an implicit method and explicit method, and a step of selecting either of the implicit method or explicit method as an optimal analysis method by comparing results from preliminary analysis, results from these analyses and experiments or exact solution.

Claims

1. An analysis method for performing a stress analysis of a device using a finite element method to analyze a first analysis model having meshes that define a discretized shape of the device, the analysis method implemented in a computer, the analysis method comprising:

searching for a minimum mesh size out of the meshes of the first analysis model;

creating a second analysis model having one or more meshes that define a shape of a simplified device different than the discretized shape of the device using the minimum mesh size, wherein the second analysis model is different from the first analysis model;

analyzing the second analysis model by using an implicit method to obtain a first analysis time;

analyzing the second analysis model by using an explicit method to obtain a first analysis time;

comparing the first analysis time with the second analysis time to obtain a comparison result;

selecting one of the implicit method or the explicit method based on the comparison result, wherein the selected one of which has a shorter analysis time;

analyzing the first analysis model using the selected method to obtain an analysis result for the stress analysis of the device, the analysis result including data on at least one of displacement, stress, or distortion; and

storing the analysis result in a storage medium,

wherein the simplified device comprises a simplified shape of the device,

wherein the different shape is a simplified shape as compared to the discretized shape, and

wherein the second analysis model is a simplified analysis model as compared to the first analysis model.

2. The analysis method of claim 1, wherein analyzing the first analysis model using the selected method, comprises:

analyzing the first analysis model using only the selected method to obtain the analysis result.

3. A computer-readable storage medium storing a program for causing a computer to execute an analysis process for performing a stress analysis of a device using a finite element method to analyze a first analysis model having meshes that define a discretized shape of the device, the analysis process comprising:

searching for a minimum mesh size out of the meshes of the first analysis model;

creating a second analysis model having one or more meshes that define a shape of a simplified device different than the discretized shape of the device using the minimum mesh size, wherein the second analysis model is different from the first analysis model;

analyzing the second analysis model by using an implicit method to obtain a first analysis time;

analyzing the second analysis model by using an explicit method to obtain a first analysis time;

comparing the first analysis time with the second analysis time to obtain a comparison result;

selecting one of the implicit method or the explicit method based on the comparison result, wherein the selected one of which has a shorter analysis time;

analyzing the first analysis model by using the selected method to obtain an analysis result for the stress analysis of the device, the analysis result including data on at least one of displacement, stress, or distortion; and

storing the analysis result in a storage medium,

wherein the simplified device comprises a simplified shape of the device,

wherein the different shape is a simplified shape as compared to the discretized shape, and

wherein the second analysis model is a simplified analysis model as compared to the first analysis model.

4. The computer-readable storage medium of claim 3,

wherein analyzing the first analysis model using the selected method, comprises:

analyzing the first analysis model using only the selected method to obtain the analysis result.

5. A finite element method analysis system for performing a stress analysis of a device, the finite element method analysis system comprising a computer configured to:

create a first analysis model having meshes that define a discretized shape of the device;

search for a minimum mesh size out of the meshes of the first analysis model;

create a second analysis model having one or more meshes that define a shape of a simplified device different than the discretized shape of the device using the minimum mesh size, wherein the second analysis model is different from the first analysis model;

analyze the second analysis model by using an implicit method to obtain a first analysis time;

analyze the second analysis model by using an explicit method to obtain a first analysis time;

compare the first analysis time with the second analysis time to obtain a comparison result;

select one of the implicit method or the explicit method based on the comparison result, wherein the selected one of which has a shorter analysis time;

analyze the first analysis model using the selected method to obtain an analysis result for the stress analysis of the device, the analysis result including data on at least one of displacement, stress, or distortion; and

store the analysis result in a storage medium,

wherein the simplified device comprises a simplified shape of the device,

wherein the different shape is a simplified shape as compared to the discretized shape, and

wherein the second analysis model is a simplified analysis model as compared to the first analysis model.

6. The finite element method analysis system of claim 5,

wherein the computer is configured to analyze the first analysis model using only the selected method to obtain the analysis result.