Film-like article and method for manufacturing the same
First Claim
1. A film-like article comprising:
- a substrate having a groove;
a circuit capable of storing information described on the substrate; and
an antenna in the groove, the antenna being connected to the circuit.
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Accused Products
Abstract
Since the chip formed from a silicon wafer is thick, the chip is protruded from the surface or the chip is so large that it can be seen through the eyes, which affects the design of a business card or the like. Hence, it is an object of the present invention to provide a new integrated circuit which has a structure by which the design is not affected. In view of the above problems, it is a feature of the invention to equip a film-like article with a thin film integrated circuit. It is another feature of the invention that the IDF chip has a semiconductor film of 0.2 mm or less, as an active region. Therefore, the IDF chip can be made thinner as compared with a chip formed from a silicon wafer. In addition, such an integrated circuit can have light transmitting characteristic unlike a chip formed from a silicon wafer.
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Citations
23 Claims
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1. A film-like article comprising:
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a substrate having a groove; a circuit capable of storing information described on the substrate; and an antenna in the groove, the antenna being connected to the circuit. - View Dependent Claims (2, 5, 8, 11, 14, 17, 18, 21)
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3. A film-like article comprising:
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a IDF chip; an antenna connected to the IDF chip through an anisotropic conductor; and a resin covering the IDF chip and the antenna, wherein the IDF chip and the antenna are provided in a depression of the film-like article. - View Dependent Claims (6, 9, 12, 15, 19, 22)
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4. A film-like article comprising:
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a substrate; a circuit capable of storing information described on the substrate; a first antenna on a top surface of the substrate; and
,a second antenna on a bottom surface of the substrate, wherein the first antenna is electrically connected to the second antenna through an opening of the substrate, and wherein the first antenna and the second antenna are electrically connected to the circuit. - View Dependent Claims (7, 10, 13, 16, 20, 23)
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Specification