Antenna using buildup structure and method of manufacturing the same
First Claim
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1. An antenna using a buildup structure, comprising:
- a dielectric layer including a first dielectric, and a second dielectric stacked on the first dielectric;
a radiator positioned on an upper surface of the dielectric layer;
a ground positioned at an under surface of the dielectric layer;
a ground line connecting the radiator and the ground; and
a chip positioned within the second dielectric, wherein the dielectric layer includes at least one via-hole to connect input/output terminals of the chip and the radiator.
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Abstract
There are provided an antenna using a buildup structure and a method of manufacturing the same. In the antenna, a tag chip is positioned within a dielectric and is connected to a radiator through a connection line or a via-hole, thereby being strong against external environments, decreasing a defective rate and enabling to be used for the special purpose of being positioned within a metal or liquid.
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Citations
14 Claims
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1. An antenna using a buildup structure, comprising:
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a dielectric layer including a first dielectric, and a second dielectric stacked on the first dielectric; a radiator positioned on an upper surface of the dielectric layer; a ground positioned at an under surface of the dielectric layer; a ground line connecting the radiator and the ground; and a chip positioned within the second dielectric, wherein the dielectric layer includes at least one via-hole to connect input/output terminals of the chip and the radiator. - View Dependent Claims (2, 3, 4, 5)
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6. An antenna using a buildup structure, comprising:
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a dielectric layer including a first dielectric, a second dielectric stacked on the first dielectric, and a third dielectric positioned amid the second dielectric and stacked on the first dielectric; a radiator positioned on an upper surface of the dielectric layer; a ground positioned at an under surface of the dielectric layer; a ground line connecting the radiator and the ground; a chip positioned within the third dielectric; and a connection line connecting the chip and the radiator. - View Dependent Claims (7)
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8. A method of manufacturing an antenna using a buildup structure, the method comprising:
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coating a first dielectric on an upper surface of a ground formed of a conductor; stacking a chip on an upper surface of the first dielectric; coating a second dielectric on the upper surface of the first dielectric on which the chip is stacked; coating a radiator on an upper surface of the second dielectric; and forming a ground line passing through the first and second dielectrics, to connect the radiator and the ground, and forming at least one via-hole passing through the second dielectric, to connect the radiator and input/output terminals of the chip. - View Dependent Claims (9, 10, 11, 12)
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13. A method of manufacturing an antenna using a buildup structure, the method comprising:
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coating a first dielectric on an upper surface of a ground formed of a conductor; coating a second dielectric on an upper surface of the first dielectric; etching a middle part of the second dielectric and stacking a chip on the etched part of the second dielectric; coating a radiator on an upper surface of the second dielectric so that the radiator is connected to a connection line of the chip; coating a third dielectric on the part where the chip is stacked; and forming a ground line passing through the first and second dielectrics to connect the radiator and the ground. - View Dependent Claims (14)
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Specification