Light-emitting device.having a frame member surrounding light-emitting elements and illumination device utilizing light-emitting device

• US 8,354,783 B2
• Filed: 09/17/2010
• Issued: 01/15/2013
• Est. Priority Date: 09/24/2009
• Status: Active Grant

• Current Assignee: Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Original Assignee: Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Inventors: Takenaka, Erika, Sanpei, Tomohiro, Idezuki, Takeo
• Primary Examiner(s): Green, Tracie Y
• Application Number:
  US12/885,005
• Publication Number:
  US 20110068674A1
• Time in Patent Office: 851 Days
• Field of Search: 313498-512, 257/40, 257/72, 257 98-100, 257642-643, 257/759, 438 38- 39
• US Class Current: 313/318.07
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/005 relating to encapsulations

Abstract

According to one embodiment, a light-emitting device includes a substrate including power-supply conductors, a frame member, and a sealing member. The power-supply conductors are formed on the substrate. A plurality of light-emitting elements including electrodes are mounted on the substrate. The electrodes of the light-emitting elements adjacent to the power-supply conductors are electrically connected to the power-supply conductors by a plurality of bonding wires. The frame member is made of resin which is coated on the substrate so as to surround the light-emitting elements and the bonding wires. The sealing member is filled in an area surrounded by the frame member and seals the light-emitting elements and the bonding wires.

Claims

1. A light-emitting device comprising:

a substrate comprising power-supply conductors disposed on the substrate;

a plurality of light-emitting elements mounted on the substrate, each of the light-emitting elements comprising electrodes;

a plurality of bonding wires which electrically connect the electrodes of particular ones of the light-emitting elements to the power-supply conductors, the particular ones of the light-emitting elements being adjacent to the power-supply conductors;

a frame member made of resin which is coated on the substrate so as to surround the light-emitting elements mounted on the substrate and the bonding wires, the frame member comprising;

a thick part where the resin is double coated on the substrate, the thickness of the thick part being greater than other areas of the frame member, wherein an entire area of the frame member including the thick part is in tight contact with the substrate continuously in a circumferential direction of the frame member; and

a top portion facing away from the substrate, the top portion comprising an outer circumferential surface formed to protrude in an arc facing away from the substrate; and

a sealing member which is filled in an area surrounded by the frame member and seals the light-emitting elements and the bonding wires, the sealing member being filled in the area up to a position which contacts the top portion of the outer circumferential surface.

2. The light-emitting device of claim 1, wherein the frame member has a polygonal shape which has a plurality of corners and a plurality of edges connecting the corners, the thick part being positioned at one of the edges.

3. The light-emitting device of claim 2, wherein the resin is coated on the substrate along a locus which corresponds to the polygonal shape and starts from one of the plurality of corners as a start point, and an end point of the locus is positioned on one of the edges immediately after passing the start point.

5. The light-emitting device of claim 1, wherein the sealing member comprises a flat surface facing away from the substrate, the flat surface being positioned closer to the substrate than a distal end of the top portion.

6. The light-emitting device of claim 5, wherein the flat surface comprises an edge which contacts the outer circumferential surface of the top portion.

4. An illumination device comprising a body, and a light-emitting device supported on the body, wherein

the light-emitting device comprises:

a substrate comprising power-supply conductors which are formed on the substrate;

a plurality of light-emitting elements mounted On the substrate, each of the light-emitting elements comprising electrodes;

a plurality of bonding wires which electrically connect the electrodes of particular ones of the light-emitting elements to the power-supply conductors, the particular ones of the light-emitting elements being adjacent to the power-supply conductors;

a frame member made of resin which is coated on the substrate so as to surround the light-emitting elements mounted on the substrate and the bonding wires, the frame member comprising;

a thick part where the resin is double coated on the substrate, the thickness of the thick part being greater than other areas of the frame member, wherein an entire area of the frame member including the thick part is in tight contact with the substrate continuously in a circumferential direction of the frame member; and

a top portion facing away from the substrate, the top portion comprising an outer circumferential surface formed to protrude in an arc facing away from the substrate; and

a sealing member which is filled in an area surrounded by the frame member and seals the light-emitting elements and the bonding wires, the sealing member being filled in the area up to a position which contacts the top portion of the outer circumferential surface.

7. A light-emitting device comprising:

a substrate;

a plurality of light-emitting elements disposed on the substrate;

a plurality of bonding wires which electrically connect the light-emitting elements;

a frame member made of resin which is coated on the substrate so as to surround the light-emitting elements and the bonding wires, the frame member comprising;

a thick part where the resin is double coated on the substrate, the thickness of the thick part being greater than other areas of the frame member, wherein an entire area of the frame member including the thick part is in tight contact with the substrate continuously in a circumferential direction of the frame member; and

a top portion facing away from the substrate, the top portion formed to protrude in an arc shape facing away from the substrate; and

a sealing member which is filled in an area surrounded by the frame member and seals the light-emitting elements and bonding wires, the sealing member comprising an edge which contacts the top portion.