Multilayered deformable element with reduced memory properties in a MEMS device

• US 8,472,100 B2
• Filed: 03/12/2008
• Issued: 06/25/2013
• Est. Priority Date: 03/12/2008
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Oden, Patrick Ian, Hornbeck, Larry Joseph, Jacobs, Simon Joshua
• Primary Examiner(s): Doak, Jennifer L.
• Application Number:
  US12/046,598
• Publication Number:
  US 20090231673A1
• Time in Patent Office: 1,931 Days
• Field of Search: 3591981-1994, 3592006-2008, 359/202.1, 359/221.2, 3592231-2251, 359/226.2, 359290-295, 359/838, 359/846, 359/871, 359/872, 250/204, 250/559.06, 250/559.29, 250/230, 250/234, 347255-260, 353/39, 353 98- 99, 385 15- 18, 385/22, 398/12, 398/19, 398/45
• US Class Current: 359/224.1
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

A deformable element for use in microelectromechanical systems comprises a core layer and a protective layer. The protective layer is capable of deterring combinations of undesired chemical components in operational environments with the core layer of the deformable element.

Claims

1. A microelectromechanical device, comprising:

a substrate having an electrode;

a deformable element comprising a conductive core layer and a protective layer formed over said conductive core layer, said deformable element being physically supported over said substrate by a first connector providing electrical connection between said conductive core layer and said electrode; and

a functional member physically supported over said deformable element by a second connector providing electrical connection between said conductive core layer and said functional member;

wherein said protective layer comprises a material for blocking a combination of an undesired chemical component with said conductive core layer, wherein said undesired chemical component is capable of changing a mechanical property of said deformable element if combined with said deformable element.

2. The device of claim 1, wherein said protective layer comprises a thin film formed by a standard thin-film fabrication technique on a major surface of the deformable element;

and is physically connected to the major surface.

3. The device of claim 2, wherein said thin film is composed of an electrically conductive or insulating material or a semiconductor material.

4. The device of claim 2, wherein the thin film is a water barrier film capable of preventing the combination of water with the deformable element.

5. The device of claim 2, wherein the thin film is electrically insulating and has an opening in which an electrically conductive material is disposed.

6. The device of claim 1, wherein said protective layer comprises a getter material.

7. The device of claim 6, wherein said getter material comprises a thin-film that is disposed on a major surface of the deformable element.

8. The device of claim 1, wherein the functional member is a reflective mirror plate;

and the deformable element is a torsional hinge to which the reflective mirror plate is attached such that the mirror plate is capable of rotating above the substrate.

9. The device of claim 1, wherein the protective layer comprises a protective film whose diffusion coefficient varies with a temperature at which the protective film is operated.

10. The device of claim 1, wherein the protective layer comprises an insulating layer formed over a main surface of the conductive core layer and a conductive layer formed over said insulating layer.

11. The device of claim 10, wherein said insulating layer has an opening;

and at least one of said first and second connectors provides electrical connection with said conductive core layer through said opening.

12. The device of claim 11, wherein said conductive layer is formed over said insulating layer in contact with said conductive core layer through said opening;

and said at least one of said first and second connectors provides electrical connection with said conductive core layer through said contact of said conductive layer with said conductive core layer through said opening.

13. The device of claim 11, wherein said insulating layer comprises a first insulating layer formed over an upper main surface of said conductive core layer, and a second insulating layer formed over a lower main surface of said conductive core layer;

said first connector provides electrical connection with said upper main surface through a first opening in said first insulating layer; and

said second connector provides electrical connection with said lower main surface through a second opening in said second insulating layer.

14. The device of claim 13, wherein said conductive layer comprises a first conductive layer formed over said first insulating layer in contact with said conductive core layer through said first opening, and a second conductive layer formed over said second insulating layer in contact with said conductive core layer through said second opening;

said first connector provides electrical connection with said conductive core layer through contact of said first conductive layer with said conductive core layer through said first opening; and

said second connector provides electrical connection with said conductive core layer through contact of said second conductive layer with said conductive core layer through said second opening.

15. The device of claim 14, wherein said first connector is formed substantially by said first conductive layer filling a portion of said first opening, and material of said functional member filling a remainder of said first opening;

and said second connector is formed substantially by said second conductive layer filling a portion of said second opening, and material of said conductive core layer filling a remainder of said second opening.

16. The device of claim 15, wherein said deformable element comprises a torsional hinge of a micromirror device;

and said functional member comprises a reflective mirror plate of said micromirror device.

17. A microelectromechanical device, comprising:

a substrate having an electrode;

a deformable element comprising a conductive core layer and a protective layer formed over said conductive core layer, said deformable element being physically supported over said substrate by a first connector providing electrical connection between said conductive core layer and said electrode; and

a functional member physically supported over said deformable element by a second connector providing electrical connection between said conductive core layer and said functional member;

wherein said protective layer comprises a material having a first diffusion coefficient at a first temperature range and a second diffusion coefficient at a second temperature range that is different from the first temperature range.

18. The device of claim 17, wherein the first temperature range is from room temperature to 70°

C.; and

wherein the second temperature range is from 70°

C. to 500°

C.

19. The device of claim 17, wherein the first diffusion coefficient is 20% or less of the second diffusion coefficient.

20. The device of claim 17, wherein the functional member is a reflective mirror plate;

and the deformable element is a deformable hinge to which the reflective mirror plate is attached such that mirror plate is capable of moving relative to the substrate.

21. The device of claim 20, wherein the protective layer comprises a thin film comprising an electrically conductive or insulating material or a semiconductor material or a getter material.

22. The device of claim 21, wherein the protective layer comprises a water getter material.

23. The device of claim 17, wherein the protective layer comprises an insulating layer formed over a main surface of the conductive core layer and a conductive layer formed over said insulating layer.

24. The device of claim 23, wherein said insulating layer has an opening;

and at least one of said first and second connectors provides electrical connection with said conductive core layer through said opening.

25. The device of claim 24, wherein said conductive layer is formed over said insulating layer in contact with said conductive core layer through said opening;

and said at least one of said first and second connectors provides electrical connection with said conductive core layer through said contact of said conductive layer with said conductive core layer through said opening.

26. The device of claim 24, wherein said insulating layer comprises a first insulating layer formed over an upper main surface of said conductive core layer, and a second insulating layer formed over a lower main surface of said conductive core layer;

said first connector provides electrical connection with said upper main surface through a first opening in said first insulating layer; and

said second connector provides electrical connection with said lower main surface through a second opening in said second insulating layer.

27. The device of claim 26, wherein said conductive layer comprises a first conductive layer formed over said first insulating layer in contact with said conductive core layer through said first opening, and a second conductive layer formed over said second insulating layer in contact with said conductive core layer through said second opening;

said first connector provides electrical connection with said conductive core layer through contact of said first conductive layer with said conductive core layer through said first opening; and

said second connector provides electrical connection with said conductive core layer through contact of said second conductive layer with said conductive core layer through said second opening.

28. The device of claim 27, wherein said first connector is formed substantially by said first conductive layer filling a portion of said first opening, and material of said functional member filling a remainder of said first opening;

and said second connector is formed substantially by said second conductive layer filling a portion of said second opening, and material of said conductive core layer filling a remainder of said second opening.

29. The device of claim 28, wherein said deformable element comprises a torsional hinge of a micromirror device;

and said functional member comprises a reflective mirror plate of said micromirror device.