Optoelectronic component, and method for the production of an optoelectronic component
First Claim
1. An optoelectronic component comprising:
- at least two connecters for electrical contacting of the component;
a housing body, in which the connecters are embedded in places; and
a heat sink, which is connected to at least one of the connecters and extends in a first plane, whereinthe housing body is formed of a plastics material,the housing body comprises an opening, in which the heat sink is freely accessible in places,at least one optoelectronic semiconductor chip is arranged in the opening on the heat sink, andat least two of the connecters each comprise a chip-end portion, which faces the at least one optoelectronic semiconductor chip, wherein the chip-end portions of the at least two connecters are arranged on the heat sink in a second, common plane, which is different from the first plane.
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Accused Products
Abstract
An optoelectronic component (1) is provided, having at least two connecters (2) for electrical contacting of the component (1), a housing body (3), in which the connecters (2) are embedded in places, a heat sink (4), which is connected to at least one connecter (2), wherein the housing body (3) is formed of a plastics material, the housing body (3) comprises an opening (30), in which the heat sink (4) is freely accessible in places, at least one optoelectronic semiconductor chip (5) is arranged in the opening (30) on the heat sink (4), and at least two of the connecters (2) each comprise a chip-end portion (2c), which faces the at least one optoelectronic semiconductor chip (5), wherein the chip-end portions (2c) of the at least two connecters (2) are arranged in a common plane.
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Citations
15 Claims
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1. An optoelectronic component comprising:
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at least two connecters for electrical contacting of the component; a housing body, in which the connecters are embedded in places; and a heat sink, which is connected to at least one of the connecters and extends in a first plane, wherein the housing body is formed of a plastics material, the housing body comprises an opening, in which the heat sink is freely accessible in places, at least one optoelectronic semiconductor chip is arranged in the opening on the heat sink, and at least two of the connecters each comprise a chip-end portion, which faces the at least one optoelectronic semiconductor chip, wherein the chip-end portions of the at least two connecters are arranged on the heat sink in a second, common plane, which is different from the first plane. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification