Light emitting device package having dielectric pattern on reflective layer

• US 8,519,418 B2
• Filed: 02/03/2011
• Issued: 08/27/2013
• Est. Priority Date: 02/04/2010
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Kim, Sun Kyung
• Primary Examiner(s): Jung, Michael
• Application Number:
  US13/020,038
• Publication Number:
  US 20110186894A1
• Time in Patent Office: 936 Days
• Field of Search: None
• US Class Current: 257/98
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

Disclosed are a light emitting device package and a lighting system. The light emitting device package includes a sub-mount including a cavity, a light emitting device chip provided in the cavity, an electrode electrically connected to the light emitting chip, a reflective layer formed on a surface of the cavity, a dielectric pattern on the reflective layer, and an encapsulant filled in the cavity.

Claims

1. A light emitting device package comprising:

a sub-mount including a cavity;

a light emitting device chip provided in the cavity;

an electrode electrically connected to the light emitting chip;

a reflective layer on the cavity;

a plurality of dielectric patterns disposed on the reflective layer;

a second dielectric layer on the reflective layer; and

an encapsulant in the cavity,

wherein the plurality of dielectric patterns is laterally disposed on a top surface of the reflective layer,

wherein each of the plurality of dielectric patterns is laterally spaced apart from every other dielectric pattern,

wherein the plurality of dielectric patterns comprises at least one of oxide, nitride and fluoride,

wherein the plurality of dielectric patterns is each formed of a same material,

wherein the plurality of dielectric patterns is formed of a material different than the encapsulant

wherein the plurality of dielectric patterns is directly disposed on the second dielectric layer, and

wherein the second dielectric layer is inter-disposed between the reflective layer and the plurality of dielectric patterns.

2. The light emitting device package of claim 1, wherein the plurality of dielectric patterns have a refractive index different than a refractive index of the encapsulant.

3. The light emitting device package of claim 1, wherein each of the plurality of dielectric patterns is spaced from other dielectric patterns by a distance in a range of 50 nm to 3,000 nm.

4. The light emitting device package of claim 1, wherein the encapsulant comprises luminescence material.

5. The light emitting device package of claim 1, wherein the light emitting device chip is provided thereon with a luminescence layer having a uniform thickness.