Method of forming an interconnect on a semiconductor substrate
First Claim
1. A method of forming a wire bond-free conductive interconnect area on a semiconductor substrate, the method comprising:
- providing a semiconductor substrate, said semiconductor substrate comprising an electrically conductive protrusion defining a bond pad;
providing a plurality of electrically conductive nanofilaments; and
immobilizing the plurality of electrically conductive nanofilaments on the electrically conductive protrusion by allowing at least one random portion of the electrically conductive nanofilaments along the length thereof to attach to the surface of the electrically conductive protrusion, anddeflecting a plurality of the electrically conductive nanofilaments attached to the surface of the electrically conductive protrusion forming an aggregate of loops of electrically conductive nanofilaments on the surface of the electrically conductive protrusion, thereby forming a conductive interconnect area on the electrically conductive protrusion without heat treatment; and
wherein the plurality of electrically conductive nanofilaments is dispersed in a liquid and is immobilized and deflected on the electrically conductive protrusion according to one ofA) by dielectrophoresis; and
B) by (i) depositing the plurality of electrically conductive nanofilaments dispersed in the liquid on the electrically conductive protrusion and (ii) allowing a portion of the liquid to be removed, thereby allowing the surface tension of the liquid to force the plurality of electrically conductive nanofilaments to contact the surface of the conductive protrusion; and
wherein the electrically conductive nanofilaments are selected to be of a flexibility that allows the surface tension of the liquid to deflect the electrically conductive nanofilaments dispersed therein upon contact with the surface of the liquid.
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Accused Products
Abstract
The present invention relates to a method of forming a wire bond-free conductive interconnect area on a semiconductor substrate. A semiconductor substrate with an electrically conductive protrusion, defining a bond pad, is provided as well as a plurality of carbon nanotubes. The plurality of carbon nanotubes is immobilized on the bond pad by allowing at least one random portion along the length of the carbon nanotubes to attach to the surface of the bond pad. Thus an aggregate of loops of carbon nanotubes is formed on the surface of the bond pad. Thereby a conductive interconnect area is formed on the electrically conductive protrusion without heat treatment.
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Citations
23 Claims
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1. A method of forming a wire bond-free conductive interconnect area on a semiconductor substrate, the method comprising:
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providing a semiconductor substrate, said semiconductor substrate comprising an electrically conductive protrusion defining a bond pad; providing a plurality of electrically conductive nanofilaments; and immobilizing the plurality of electrically conductive nanofilaments on the electrically conductive protrusion by allowing at least one random portion of the electrically conductive nanofilaments along the length thereof to attach to the surface of the electrically conductive protrusion, and deflecting a plurality of the electrically conductive nanofilaments attached to the surface of the electrically conductive protrusion forming an aggregate of loops of electrically conductive nanofilaments on the surface of the electrically conductive protrusion, thereby forming a conductive interconnect area on the electrically conductive protrusion without heat treatment; and wherein the plurality of electrically conductive nanofilaments is dispersed in a liquid and is immobilized and deflected on the electrically conductive protrusion according to one of A) by dielectrophoresis; and B) by (i) depositing the plurality of electrically conductive nanofilaments dispersed in the liquid on the electrically conductive protrusion and (ii) allowing a portion of the liquid to be removed, thereby allowing the surface tension of the liquid to force the plurality of electrically conductive nanofilaments to contact the surface of the conductive protrusion; and
wherein the electrically conductive nanofilaments are selected to be of a flexibility that allows the surface tension of the liquid to deflect the electrically conductive nanofilaments dispersed therein upon contact with the surface of the liquid. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of interconnecting two semiconductor substrates in a wire bond-free manner, the method comprising:
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providing a first semiconductor substrate, said first semiconductor substrate comprising a first electrically conductive protrusion defining a first bond pad; providing a second semiconductor substrate, said second semiconductor substrate comprising a second electrically conductive protrusion defining a second bond pad; providing a first plurality of electrically conductive nanofilaments; immobilizing the first plurality of electrically conductive nanofilaments on the first electrically conductive protrusion by allowing at least one random portion of said electrically conductive nanofilaments along the length thereof to attach to the surface of the first electrically conductive protrusion, and deflecting a plurality of the electrically conductive nanofilaments attached to the surface of the first electrically conductive protrusion forming a first aggregate of loops of electrically conductive nanofilaments on the surface of the first electrically conductive protrusion, thereby forming a first conductive interconnect area on the first electrically conductive protrusion without heat treatment; providing a second plurality of electrically conductive nanofilaments; immobilizing the second plurality of electrically conductive nanofilaments on the second electrically conductive protrusion by allowing at least one random portion of said electrically conductive nanofilaments along the length thereof to attach to the surface of the second electrically conductive protrusion, and deflecting a plurality of the electrically conductive nanofilaments attached to the surface of the second electrically conductive protrusion forming a second aggregate of loops of electrically conductive nanofilaments on the surface of the second electrically conductive protrusion, thereby forming a second conductive interconnect area on the second electrically conductive protrusion without heat treatment; and contacting the first electrically conductive protrusion, on which the first plurality of electrically conductive nanofilaments is immobilized, with the second electrically conductive protrusion, on which the second plurality of electrically conductive nanofilaments is immobilized, thereby allowing non-covalent interaction between the first and the second aggregate of loops of electrically conductive nanofilaments to join the first and the second electrically conductive protrusion together; and wherein the first and/or second plurality of electrically conductive nanofilaments is dispersed in a liquid and is immobilized and deflected on the electrically conductive protrusion according to one of A) by dielectrophoresis; and B) by (i) depositing the plurality of electrically conductive nanofilaments dispersed in the liquid on the electrically conductive protrusion and (ii) allowing a portion of the liquid to be removed, thereby allowing the surface tension of the liquid to force the plurality of electrically conductive nanofilaments to contact the surface of the conductive protrusion; and
wherein the electrically conductive nanofilaments are selected to be of a flexibility that allows the surface tension of the liquid to deflect the electrically conductive nanofilaments dispersed therein upon contact with the surface of the liquid. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A method of interconnecting two semiconductor substrates in a wire bond-free manner, the method comprising:
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providing a first semiconductor substrate, said first semiconductor substrate comprising an electrically conductive protrusion defining a first bond pad; providing a first plurality of electrically conductive nanofilaments; immobilizing the first plurality of electrically conductive nanofilaments on the first electrically conductive protrusion by at least one random portion of the electrically conductive nanofilaments along the length thereof to attach to the surface of the first electrically conductive protrusion; deflecting a plurality of the electrically conductive nanofilaments attached to the surface of the first electrically conductive protrusion forming an aggregate of loops of electrically conductive nanofilaments on the surface of the first electrically conductive protrusion, thereby forming a first conductive interconnect area on the first electrically conductive protrusion without heat treatment; providing a second semiconductor substrate, said second semiconductor substrate comprising a second electrically conductive protrusion defining a second bond pad, wherein on the second electrically conductive protrusion there is immobilized a second plurality of electrically conductive nanofilaments, wherein each electrically conductive nanofilament of the second plurality of electrically conductive nanofilaments has a free end; and contacting the first electrically conductive protrusion, on which the first plurality of electrically conductive nanofilaments is immobilized, with the second electrically conductive protrusion, on which the second plurality of electrically conductive nanofilaments is immobilized, thereby allowing the free ends of the second plurality of electrically conductive nanofilaments on the second electrically conductive protrusion to enter the loops of the aggregate of the first plurality of electrically conductive nanofilaments on the first electrically conductive protrusion; and wherein the first and/or second plurality of electrically conductive nanofilaments is dispersed in a liquid and is immobilized and/or deflected on the electrically conductive protrusion according to one of A) by dielectrophoresis; and B) by (i) depositing the plurality of electrically conductive nanofilaments dispersed in the liquid on the electrically conductive protrusion and (ii) allowing a portion of the liquid to be removed, thereby allowing the surface tension of the liquid to force the plurality of electrically conductive nanofilaments to contact the surface of the conductive protrusion; and
wherein the electrically conductive nanofilaments are selected to be of a flexibility that allows the surface tension of the liquid to deflect the electrically conductive nanofilaments dispersed therein upon contact with the surface of the liquid. - View Dependent Claims (17, 18, 19, 20, 21)
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22. A method of forming a wire bond-free conductive interconnect area on a semiconductor substrate, the method comprising:
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providing a semiconductor substrate, said semiconductor substrate comprising an electrically conductive protrusion defining a bond pad; providing a plurality of electrically conductive nanofilaments; and immobilizing the plurality of electrically conductive nanofilaments on the electrically conductive protrusion forming an aggregate of loops of electrically conductive nanofilaments on the surface of the electrically conductive protrusion according to the method steps of; (i) depositing the plurality of electrically conductive nanofilaments on the electrically conductive protrusion; (ii) dispersing said plurality of electrically conductive nonofilaments desposited on said electrically conductive protrusion in a liquid; (iii) removing a portion of the liquid containing the plurality of electrically conductive nanofilaments, generating a surface tension between the nanofilaments and the remaining liquid; (iv) deflecting and bending the electrically conductive nanofilaments dispersed in said liquid with said generated surface tension; (v) forcing a plurality of said electrically conductive nanofilaments to contact the surface of the conductive protrusion with said generated surface tension; (vi) attaching random portions of the plurality of electrically conductive nanofilaments to the surface of the electrically conductive protrusion through said forced contact, thereby forming a conductive interconnect area on the electrically conductive protrusion without heat treatment. - View Dependent Claims (23)
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Specification