Interposer package for CMOS image sensor and method of making same

• US 8,796,800 B2
• Filed: 11/21/2011
• Issued: 08/05/2014
• Est. Priority Date: 11/21/2011
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage
• Primary Examiner(s): SANDVIK, BENJAMIN P
• Application Number:
  US13/301,683
• Publication Number:
  US 20130127000A1
• Time in Patent Office: 988 Days
• Field of Search: 257431-434
• US Class Current: 257/433
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Abstract

An image sensor package and method of manufacture that includes a crystalline handler with conductive elements extending therethrough, an image sensor chip disposed in a cavity of the handler, and a transparent substrate disposed over the cavity and bonded to both the handler and image sensor chip. The transparent substrate includes conductive traces that electrically connect the sensor chip'"'"'s contact pads to the handler'"'"'s conductive elements, so that off-chip signaling is provided by the substrate'"'"'s conductive traces and the handler'"'"'s conductive elements.

Claims

1. An image sensor package, comprising:

a handler assembly that includes;

a conductive crystalline handler having opposing first and second surfaces, wherein the handler includes a cavity formed into the first surface, and

a plurality of conductive elements each extending from the first surface, through the crystalline handler, to the second surface, wherein for each of the conductive elements, a dielectric layer is disposed between the conductive element and the conductive crystalline handler;

a sensor chip disposed in the cavity, wherein the sensor chip includes;

a substrate with front and back opposing surfaces,

a plurality of photo detectors formed at the front surface, and

a plurality of contact pads formed at the front surface which are electrically coupled to the photo detectors; and

a substrate assembly that includes;

a substrate having opposing top and bottom surfaces, wherein the substrate is optically transparent to at least one range of light wavelengths, and

a plurality of electrically conductive traces formed on the bottom surface and insulated from the substrate by a compliant dielectric material that is disposed only between the plurality of electrically conductive traces and the bottom surface;

wherein the substrate is disposed over the cavity and bonded to the crystalline handler and the sensor chip such that;

each of the contact pads is electrically connected to at least one of the electrically conductive traces by a first conductive pad disposed between and electrically connecting the contact pad and the at least one electrically conductive traces, and

each of the electrically conductive traces is electrically connected to at least one of the conductive elements by a second conductive pad disposed between and electrically connecting the electrically conductive trace and the at least one conductive element.

2. The image sensor package of claim 1, further comprising:

a plurality of surface mount interconnects each disposed over the second surface of the crystalline handler, and each electrically connected to one of the conductive elements.

3. The image sensor package of claim 1, wherein the sensor chip further comprises:

a plurality of color filters and microlenses mounted over the photo detectors.

4. The image sensor package of claim 1, wherein a portion of the substrate top surface disposed over the photo detectors is non-planar.