Simultaneously tagging of semiconductor components on a wafer
First Claim
1. A wireless automatic test equipment for simultaneously testing a plurality of semiconductor components formed onto a semiconductor wafer, comprising:
- a transmitter module configured to simultaneously send a plurality of initiate self-contained testing operation signals to the plurality of semiconductor components;
a receiver module configured to receive a plurality of testing operation outcomes from the plurality of semiconductor components over a common communication channel to provide a plurality of recovered testing outcomes, each of the plurality of recovered testing outcomes having a corresponding innate identification number from among a plurality of unique identification numbers that identifies one of the plurality of semiconductor components and indicating whether its respective semiconductor component operates as expected; and
a testing processor configured to determine a first group of semiconductor components from among the plurality of semiconductor components that operate as expected based upon the plurality of recovered testing outcomes and corresponding first locations of the first grotto of semiconductor components within the semiconductor wafer based upon their corresponding unique identification numbers from among the identification numbers.
6 Assignments
0 Petitions
Accused Products
Abstract
Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.
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Citations
22 Claims
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1. A wireless automatic test equipment for simultaneously testing a plurality of semiconductor components formed onto a semiconductor wafer, comprising:
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a transmitter module configured to simultaneously send a plurality of initiate self-contained testing operation signals to the plurality of semiconductor components; a receiver module configured to receive a plurality of testing operation outcomes from the plurality of semiconductor components over a common communication channel to provide a plurality of recovered testing outcomes, each of the plurality of recovered testing outcomes having a corresponding innate identification number from among a plurality of unique identification numbers that identifies one of the plurality of semiconductor components and indicating whether its respective semiconductor component operates as expected; and a testing processor configured to determine a first group of semiconductor components from among the plurality of semiconductor components that operate as expected based upon the plurality of recovered testing outcomes and corresponding first locations of the first grotto of semiconductor components within the semiconductor wafer based upon their corresponding unique identification numbers from among the identification numbers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 22)
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11. A semiconductor component formed on a semiconductor water, comprising:
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a transceiver module configured to receive a plurality of initiate testing operation signals and to provide a plurality of initiate test control signals; a metric measurement module configured to determine a plurality of signal metrics for the plurality of initiate test control signals; a testing module configured to generate a unique identification number for the semiconductor component based upon the plurality of signal metrics and to provide a self-contained testing operation in response to the plurality of initiate test control signals; and an integrated circuit under test configured to provide an indication of operability in response to executing the self-contained testing operation, the indication of operability indicating whether the integrated circuit under test operates as expected, wherein the testing module is further configured to append the unique identification number to the indication of operability. - View Dependent Claims (12, 13, 14, 15)
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16. A semiconductor component formed on a semiconductor wafer, comprising:
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a transceiver module configured to receive a plurality of initiate testing operation signals to provide a plurality of initiate test control signals; a testing module configured to generate a unique identification number for the semiconductor component and to provide a self-contained testing operation in response to the plurality of initiate test control signals; and an integrated circuit under test configured to provide an indication of operability in response to executing the sells-contained testing operation, the indication of operability indicating whether the integrated circuit under test operates as expected, wherein the testing module is further configured to append the unique identification number to the indication of operability. - View Dependent Claims (17, 18, 19, 20, 21)
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Specification