Method for fabricating butt-coupled electro-absorptive modulators
First Claim
1. A method for fabricating an electro-absorptive modulator or detector, said method comprising:
- forming a doped semiconductor layer on a substrate;
depositing a first cladding layer on said doped semiconductor layer;
depositing and patterning a waveguide layer to form a plurality of waveguides;
depositing a second cladding layer on top of said waveguide layer;
etching a trench through said second cladding layer, said waveguide layer, and said first cladding layer to expose said doped semiconductor layer;
depositing a film spacer layer on top of said second cladding layer to cover said trench;
etching said film spacer layer to form respective sidewalls within said trench; and
forming an electro-absorptive modulator within said trench such that said electro-absorptive modulator is butt-coupled to said waveguides via said sidewalls.
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Abstract
A method for fabricating butt-coupled electro-absorptive modulators is disclosed. A butt-coupled electro-absorptive modulator with minimal dislocations in the electro-absorptive material is produced by adding a dielectric spacer for lining the coupling region before epitaxially growing the SiGe or other electro-absorptive material. It has been determined that during the SiGe growth, the current process has exposed single crystal silicon at the bottom of the hole and exposed amorphous silicon on the sides. SiGe growth on the amorphous silicon is expected to have more dislocations than single crystal silicon. There should also be dislocations or fissures where the SiGe growth from the each nucleation source finally join. Thus, a dielectric sidewall can protect an exposed waveguide face from any etching from an aggressive surface preparation prior to epi growth.
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Citations
6 Claims
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1. A method for fabricating an electro-absorptive modulator or detector, said method comprising:
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forming a doped semiconductor layer on a substrate; depositing a first cladding layer on said doped semiconductor layer; depositing and patterning a waveguide layer to form a plurality of waveguides; depositing a second cladding layer on top of said waveguide layer; etching a trench through said second cladding layer, said waveguide layer, and said first cladding layer to expose said doped semiconductor layer; depositing a film spacer layer on top of said second cladding layer to cover said trench; etching said film spacer layer to form respective sidewalls within said trench; and forming an electro-absorptive modulator within said trench such that said electro-absorptive modulator is butt-coupled to said waveguides via said sidewalls. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification