Wireless integrated circuit device and method of manufacturing the same
First Claim
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1. A wireless IC device comprising:
- a base material sheet that has a substantially rectangular shape having a long-side direction and a short-side direction;
an antenna element that is provided on a surface of the base material sheet and that has two radiation parts extending in the long side direction with a predetermined gap therebetween and two connection parts located in the gap through which the two radiation parts oppose each other;
a wireless IC element that is connected to the two connection parts via a conductive bonding material; and
a resist layer that regulates the movement of the conductive bonding material;
whereinthe resist layer covers the two radiation parts and does not cover the two connection parts and at least areas adjacent to the connection parts in the short-side direction; and
wherein the resist layer is completely divided in the long-side direction so as to separately cover the two radiation parts and so as not to cover the two connection parts and entire areas extending from each of the two connection parts to side surfaces of the base material sheet in the short-side direction.
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Abstract
A wireless IC device includes a base material sheet having a long-side direction and a short-side direction, an antenna element provided on a surface of the base material sheet and that includes two radiation portions extending in the long side direction with a predetermined gap therebetween and two connection portions located in a gap through which the two radiation portions oppose each other, a wireless IC element connected to the two connection portions via a conductive bonding material, and a resist layer that covers the two radiation portions and does not cover the two connection portions and at least areas adjacent to the connection portions in the short-side direction.
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Citations
18 Claims
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1. A wireless IC device comprising:
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a base material sheet that has a substantially rectangular shape having a long-side direction and a short-side direction; an antenna element that is provided on a surface of the base material sheet and that has two radiation parts extending in the long side direction with a predetermined gap therebetween and two connection parts located in the gap through which the two radiation parts oppose each other; a wireless IC element that is connected to the two connection parts via a conductive bonding material; and a resist layer that regulates the movement of the conductive bonding material;
whereinthe resist layer covers the two radiation parts and does not cover the two connection parts and at least areas adjacent to the connection parts in the short-side direction; and wherein the resist layer is completely divided in the long-side direction so as to separately cover the two radiation parts and so as not to cover the two connection parts and entire areas extending from each of the two connection parts to side surfaces of the base material sheet in the short-side direction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of manufacturing a wireless IC device comprising:
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preparing a base material sheet that has a substantially rectangular shape having a long-side direction and a short-side direction; forming on a surface of the base material sheet an antenna element that has two radiation parts extending in the long side direction with a predetermined gap therebetween and two connection parts formed in the gap through which the two radiation parts oppose each other; arranging a resist layer in such a manner that the resist layer covers the two radiation parts and does not cover the two connection parts and at least areas adjacent to the connection parts in the short-side direction, wherein the resist layer is completely divided in the long-side direction so as to separately cover the two radiation parts and so as not to cover the two connection parts and entire areas extending from each of the two connection parts to side surfaces of the base material sheet in the short-side direction; disposing a conductive bonding material on the two connection parts after arranging the resist layer; and connecting a wireless IC element to the conductive bonding material. - View Dependent Claims (15, 16, 17, 18)
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Specification