WIRELESS INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
1 Assignment
0 Petitions
Accused Products
Abstract
A wireless IC device includes a base material sheet having a long-side direction and a short-side direction, an antenna element provided on a surface of the base material sheet and that includes two radiation portions extending in the long side direction with a predetermined gap therebetween and two connection portions located in a gap through which the two radiation portions oppose each other, a wireless IC element connected to the two connection portions via a conductive bonding material, and a resist layer that covers the two radiation portions and does not cover the two connection portions and at least areas adjacent to the connection portions in the short-side direction.
5 Citations
21 Claims
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1. (canceled)
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2. A wireless IC device comprising:
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a base material sheet that has a substantially rectangular shape having a long-side direction and a short-side direction; an antenna element that is provided on a surface of the base material sheet and that has two radiation parts extending in the long side direction with a predetermined gap therebetween and two connection parts located in the gap through which the two radiation parts oppose each other; a wireless IC element that is connected to the two connection parts via a conductive bonding material; and a resist layer that regulates the movement of the conductive bonding material;
whereinthe resist layer covers the two radiation parts and does not cover the two connection parts and at least areas adjacent to the connection parts in the short-side direction. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of manufacturing a wireless IC device comprising:
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preparing a base material sheet that has a substantially rectangular shape having a long-side direction and a short-side direction; forming on a surface of the base material sheet an antenna element that has two radiation parts extending in the long side direction with a predetermined gap therebetween and two connection parts formed in the gap through which the two radiation parts oppose each other; arranging a resist layer in such a manner that the resist layer covers the two radiation parts and does not cover the two connection parts and at least areas adjacent to the connection parts in the short-side direction; disposing a conductive bonding material on the two connection parts after arranging the resist layer; and connecting a wireless IC element to the conductive bonding material. - View Dependent Claims (18, 19, 20, 21)
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Specification