Light-emitting device

• US 8,922,118 B2
• Filed: 12/26/2013
• Issued: 12/30/2014
• Est. Priority Date: 06/30/2011
• Status: Expired due to Fees

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Yamanaka, Kazuhiko, Yoshida, Shinji, Takigawa, Shinichi, Katayama, Takuma, Nakanishi, Hideyuki, Tanaka, Tsuyoshi
• Primary Examiner(s): Bowman, Mary Ellen
• Application Number:
  US14/141,102
• Publication Number:
  US 20140103798A1
• Time in Patent Office: 369 Days
• Field of Search: 313/512
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H05B 33/04 : Sealing arrangements , e.g. against humidity

Abstract

A light-emitting device includes: a package; a semiconductor light-emitting element mounted above the package; a cap component provided above the package; a sealing component which seals a space between the package and the cap component; and a phosphor containing resin including phosphor disposed in the sealed space.

Claims

1. A light-emitting device comprising:

a package;

a semiconductor light-emitting element mounted above the package;

a cap component provided above the package;

a sealing component which seals a space between the package and the cap component; and

phosphor disposed in the sealed space,

wherein a surface of at least one of the cap component and the package is treated to be water repellent, the surface facing the semiconductor light-emitting element.

2. The light-emitting device according to claim 1, wherein a cavity including gas is formed in the sealed space.

3. The light-emitting device according to claim 2, wherein the cavity includes gas other than oxygen or is a vacuum.

4. The light-emitting device according to claim 1, wherein the package has a structure in which a metal line is embedded in a ceramic material.

5. The light-emitting device according to claim 1, wherein the cap component comprises a translucent acrylic resin or a translucent epoxy resin.

6. The light-emitting device according to claim 1, wherein the cap component comprises translucent glass.

7. The light-emitting device according to claim 1, wherein the phosphor includes a plurality of types of phosphor particles.

8. The light-emitting device according to claim 1, wherein the phosphor is quantum dot phosphor.

9. The light-emitting device according to claim 7, wherein the phosphor particles of the types are enclosed in the sealed space.

10. The light-emitting device according to claim 1, wherein at least one of types of the phosphor includes a rare-earth activated phosphor material.

11. The light-emitting device according to claim 1, wherein the phosphor is mixed into different resin materials.

12. The light-emitting device according to claim 1, wherein the cap component includes phosphor.

13. The light-emitting device according to claim 1, wherein the surface of at least one of the cap component and the package is treated with fluoride resin to be water repellent.

14. The light-emitting device according to claim 1, further comprising:

a reflection film disposed between the package and the semiconductor light-emitting element,

wherein a surface of the reflection film is treated to be water repellent, the surface of the reflection film facing the semiconductor light-emitting element.

15. The light-emitting device according to claim 14, wherein the surface of the reflection film is treated with fluoride resin to be water repellent.

16. The light-emitting device according to claim 2, wherein the package includes a step portion such that the cavity is formed between the step portion and the cap component.

17. The light-emitting device according to claim 16, further comprising:

a reflection film disposed between the package and the semiconductor light-emitting element, the reflection film disposed on the step portion,

wherein a surface of the reflection film is treated to be water repellent, the surface of the reflection film facing the semiconductor light-emitting element.

18. The light-emitting device according to claim 17, wherein the surface of the reflection film is treated with fluoride resin to be water repellent.

19. The light-emitting device according to claim 2, wherein the cavity includes nitrogen component.

20. The light-emitting device according to claim 16, wherein the cavity includes nitrogen component.