Encapsulated electromechanical devices
First Claim
Patent Images
1. An electromechanical device, comprising:
- a substrate;
an electromechanical element on the substrate, the electromechanical element comprising a movable reflective layer;
a layer encapsulating the electromechanical element, wherein the layer is planarized; and
an electronic element on or over the layer on a side of the layer distal to the electromechanical element.
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Abstract
Encapsulation is provided to electromechanical devices to protect the devices from such environmental hazards as moisture and mechanical shock. In addition to the encapsulation layer providing protection from environmental hazards, the encapsulation layer is additionally planarized so as to function as a substrate for additional circuit elements formed above the encapsulation layer.
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Citations
30 Claims
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1. An electromechanical device, comprising:
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a substrate; an electromechanical element on the substrate, the electromechanical element comprising a movable reflective layer; a layer encapsulating the electromechanical element, wherein the layer is planarized; and an electronic element on or over the layer on a side of the layer distal to the electromechanical element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. An electromechanical device, comprising:
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means for supporting an electromechanical element, the electromechanical element comprising a movable means for reflecting light; means for encapsulating the electromechanical element, wherein the encapsulating means is planarized; and means for processing electronic signals on or over the encapsulating means on a side of the encapsulating means distal to the electromechanical element. - View Dependent Claims (21, 22, 23, 24)
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25. A method of manufacturing an encapsulated electromechanical device, comprising:
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forming an electromechanical element on a substrate, the electromechanical element comprising a movable reflective layer; forming an encapsulation layer encapsulating the electromechanical element; planarizing said encapsulation layer; and forming an electronic element on or over the encapsulation layer on a side of the encapsulation later distal to the electromechanical element. - View Dependent Claims (26, 27, 28, 29, 30)
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Specification