Apparatus with a multi-layer coating and method of forming the same
First Claim
1. A printed circuit board, comprising:
- a substrate comprising an insulating material;
a plurality of conductive tracks attached to at least one surface of the substrate;
a multi-layer coating deposited on the at least one surface of the substrate, the multi-layer coating covering at least a portion of the plurality of conductive tracks, the multi-layer coating comprising at least one layer formed of a halo-hydrocarbon polymer; and
at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating;
the solder joint is formed on a particular region of the substrate after a substantially continuous layer of the multi-layer coating is deposited on the substrate; and
the soldering alters the multi-layer coating at the particular region of the substrate without altering the multi-layer coating at other regions of the substrate.
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Accused Products
Abstract
In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
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Citations
44 Claims
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1. A printed circuit board, comprising:
a substrate comprising an insulating material;
a plurality of conductive tracks attached to at least one surface of the substrate;
a multi-layer coating deposited on the at least one surface of the substrate, the multi-layer coating covering at least a portion of the plurality of conductive tracks, the multi-layer coating comprising at least one layer formed of a halo-hydrocarbon polymer; and
at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating;
the solder joint is formed on a particular region of the substrate after a substantially continuous layer of the multi-layer coating is deposited on the substrate; and
the soldering alters the multi-layer coating at the particular region of the substrate without altering the multi-layer coating at other regions of the substrate.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method, comprising:
- attaching a plurality of conductive tracks to at least one surface of a substrate comprising an insulating material;
depositing a multi-layer coating on the at least one surface of the substrate, the multi-layer coating covering at least a portion of the plurality of conductive tracks, at least one layer of the multi-layer coating comprising at least one halo-hydrocarbon polymer; and
after depositing the multi-layer coating, soldering through the multi-layer coating to form a solder joint between an electrical component and at least one conductive track attached to the substrate, the solder joint abutting the multi-layer coating;
the solder joint is formed on a particular region of the substrate after a substantially continuous layer of the multi-layer coating is deposited on the substrate; and
the soldering alters the multi-layer coating at the particular region of the substrate without altering the multi-layer coating at other regions of the substrate. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44)
- attaching a plurality of conductive tracks to at least one surface of a substrate comprising an insulating material;
Specification