Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
First Claim
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1. A device comprising:
- a first substrate layer;
a metallization layer formed on a surface of the first substrate layer, wherein the metallization layer comprises a first slot to expose a portion of the first substrate layer;
wherein the metallization layer acts as an antenna and a sealing cover for an item within a packaging;
a radio frequency identification (RFID) chip over the portion of the first substrate layer;
a conductive layer which couples the RFID chip to the metallization layer,wherein the first slot in the metallization layer determines the antenna configuration for the RFID chip.
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Abstract
An RFID device. The device comprises a conductive layer formed on a first substrate. An opening line (or two or more opening lines) is formed in the conductive layer to make the conductive layer a part of an antenna structure. An integrated circuit chip is placed over at least a portion the opening line and coupled to the conductive layer. The integrated circuit chip is electrically interconnected to the conductive layer.
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Citations
20 Claims
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1. A device comprising:
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a first substrate layer; a metallization layer formed on a surface of the first substrate layer, wherein the metallization layer comprises a first slot to expose a portion of the first substrate layer;
wherein the metallization layer acts as an antenna and a sealing cover for an item within a packaging;a radio frequency identification (RFID) chip over the portion of the first substrate layer; a conductive layer which couples the RFID chip to the metallization layer, wherein the first slot in the metallization layer determines the antenna configuration for the RFID chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 16, 17, 18)
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8. A method for creating a device comprising:
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forming a first slot in a metallization layer to expose a portion of a surface of a first substrate layer;
wherein the metallization layer acts as an antenna and a sealing cover for an item within a packaging;depositing a radio frequency identification (RFID) chip over the portion of the first substrate layer; coupling the RFID chip to the metallization layer by a conductive layer which extends from the RFID chip to the metallization layer, wherein the first slot in the metallization layer determines the antenna configuration for the RFID chip. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 19, 20)
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Specification