Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

• US 9,070,063 B2
• Filed: 08/27/2012
• Issued: 06/30/2015
• Est. Priority Date: 11/22/2004
• Status: Active Grant

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Inventors: Carrender, Curt
• Primary Examiner(s): SANDVIK, BENJAMIN P
• Application Number:
  US13/595,750
• Publication Number:
  US 20120318872A1
• Time in Patent Office: 1,037 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07788 the antenna being of the capacitive type
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/2445 Tag integrated into item to be protected, e.g. source tagging
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/7665 Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/82039 using a laser
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 : the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: Y10T 29/49016 : Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base

Abstract

An RFID device. The device comprises a conductive layer formed on a first substrate. An opening line (or two or more opening lines) is formed in the conductive layer to make the conductive layer a part of an antenna structure. An integrated circuit chip is placed over at least a portion the opening line and coupled to the conductive layer. The integrated circuit chip is electrically interconnected to the conductive layer.

Claims

1. A device comprising:

a first substrate layer;

a metallization layer formed on a surface of the first substrate layer, wherein the metallization layer comprises a first slot to expose a portion of the first substrate layer;

wherein the metallization layer acts as an antenna and a sealing cover for an item within a packaging;

a radio frequency identification (RFID) chip over the portion of the first substrate layer;

a conductive layer which couples the RFID chip to the metallization layer,

wherein the first slot in the metallization layer determines the antenna configuration for the RFID chip.

2. The device of claim 1 wherein the antenna configuration is selected from a group consisting of loop, circular, straight, curved, folded, and dipole.

3. The device of claim 1 wherein the RFID chip is deposited in a second substrate having a receptor configured to receive the RFID chip and wherein the second substrate is adhered to the first substrate layer.

4. The device of claim 1, wherein the metallization layer has a second slot to provide a resonator for the RFID chip.

5. The device of claim 1, wherein the conductive layer comprises one or more conductive pads.

6. The device of claim 1 further comprising a conductive interconnect coupled to the conductive layer that acts as a resonator for the RFID chip.

7. The device of claim 1 wherein the packaging is at least one of a Blister Pack tray or a bottle.

16. The device of claim 1, wherein the first slot extends to an edge of the metallization layer.

17. The device of claim 1, wherein the item is deposited between the first substrate layer and the metallization layer.

18. The device of claim 1, further comprising

a cap layer over the RFID chip.

8. A method for creating a device comprising:

forming a first slot in a metallization layer to expose a portion of a surface of a first substrate layer;

wherein the metallization layer acts as an antenna and a sealing cover for an item within a packaging;

depositing a radio frequency identification (RFID) chip over the portion of the first substrate layer;

coupling the RFID chip to the metallization layer by a conductive layer which extends from the RFID chip to the metallization layer, wherein the first slot in the metallization layer determines the antenna configuration for the RFID chip.

9. The method of claim 8 wherein the antenna configuration is selected from a group consisting of loop, circular, straight, curved, folded, and dipole.

10. The method of claim 8 further comprising:

placing a cap layer over the conductive layer and the RFID chip.

11. The method of claim 8 further comprising:

recessing the RFID chip into a second substrate; and

coupling the second substrate to the first substrate layer.

12. The method of claim 8 wherein the first slot in the metallization layer is formed using a cutting tool.

13. The method of claim 8 further comprising

forming a second slot in the metallization layer to provide a resonator for the RFID chip.

14. The method of claim 8 further comprising

coupling the RFID chip to the metallization layer at two sides of the first slot.

15. The method of claim 8, wherein the conductive layer comprises one or more conductive pads.

19. The method of claim 8, wherein the packaging is at least one of a Blister Pack tray or a bottle.

20. The method of claim 8, further comprising

forming a conductive interconnect to couple to the conductive layer to act as a resonator for the RFID chip.