System and methods for thermal control using sensors on die

• US 9,285,278 B2
• Filed: 05/09/2013
• Issued: 03/15/2016
• Est. Priority Date: 05/09/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Heresztyn, Amaury J., Chowdhury, Ihtesham H., Cox, Keith
• Primary Examiner(s): Jagan, Mirellys
• Application Number:
  US13/891,030
• Publication Number:
  US 20140334107A1
• Time in Patent Office: 1,041 Days
• Field of Search: 374/1, 374/110, 374/112, 374/166, 374/137, 374/115, 374/152, 374/25, 374/29, 374/134
• US Class Current: 1/1
• CPC Class Codes: G01K 7/01 using semiconducting elements having PN junctions G01K7/02, G01K7/16, G01K7/30 take precedence

Abstract

A portable electronic device including a temperature sensor embedded in a die is provided. To process temperature measurements the portable electronic device includes a processor circuit coupled to the temperature sensor, the processor circuit configured to read a measurement from the temperature sensor when an integrated circuit in the die is inactive. Furthermore, a memory circuit coupled to the processor circuit and the temperature sensor stores a temperature gradient provided by the temperature sensor. A Printed Circuit Board for use in a portable electronic device as above is also provided. A method for performing thermal control in a portable electronic device as above is also provided.

Claims

1. A Printed Circuit Board (PCB) in communication with a processor circuit and configured to determine a representative temperature of the PCB, the PCB comprising:

a first temperature sensor embedded within a first integrated circuit (IC) directly measuring a first temperature of the first integrated circuit (IC);

a second temperature sensor embedded within a second integrated circuit (IC) directly measuring a second temperature of the second IC;

a component; and

wherein the processor circuit is configured to;

receive the first temperature and the second temperature,

run a simulation program stored on a memory circuit to establish a temperature gradient, based upon the first temperature and the second temperature, across the PCB, and

perform a remedial action to the component based upon the temperature gradient.

2. The PCB as recited in claim 1, wherein the remedial action comprises deactivating the component to define a sleep mode of the component.

3. The PCB as recited in claim 1, wherein the processor circuit, the memory circuit, first IC, and the second IC are disposed on the PCB.

4. The PCB as recited in claim 3, further comprising:

a third temperature sensor embedded within a third integrated circuit (IC) directly measuring a third temperature of the third IC disposed on the PCB, wherein the processor circuit is configured to run the simulation program stored on the memory circuit to establish the temperature gradient based upon the first temperature, the second temperature, and the third temperature.

5. The PCB as recited in claim 4, wherein at least one of the first IC, the second IC, or the third IC comprises a power amplifier used for a radio frequency antenna.

6. The PCB as recited in claim 5, wherein when the processor circuit runs the simulation program to establish the temperature gradient, the processor circuit does not use a temperature from one or more inactive integrated circuits.

7. The PCB as recited in claim 6, wherein the component comprises a battery.

8. A portable electronic device configured to perform a remedial action in response to a thermal flux within the portable electronic device, the portable electronic device comprising:

a printed circuit board (PCB);

a temperature sensor embedded within an IC disposed on the PCB and that directly measures a temperature of the first IC;

a processor circuit that receives multiple temperature readings of the PCB from the temperature sensor embedded within the IC to establish a simulated temperature gradient across the PCB based upon the multiple temperature readings;

a memory circuit that sends to the processor circuit a simulation program to establish the simulated temperature gradient; and

a component disposed on the PCB, the component receiving the remedial action based upon the simulated temperature gradient.

9. The portable electronic device as recited in claim 8, further comprising:

a second temperature sensor embedded in a second IC disposed on the PCB;

a third temperature sensor embedded in a third IC disposed on the PCB; and

wherein the multiple temperature readings are determined by the temperature sensor, the second temperature sensor, and the third temperature sensor.

10. The portable electronic device as recited in claim 8, wherein the processor circuit processes a statistical operation of the multiple temperature readings to determine the simulated temperature gradient.

11. The portable electronic device as recited in claim 10, wherein the statistical operation comprises an average of the multiple temperature readings only from a first temperature sensor and a third temperature sensor.

12. The portable electronic device as recited in claim 11, wherein the first temperature sensor is closer to the component than the second temperature sensor and the third temperature sensor.