Method for connecting inter-layer conductors and components in 3D structures

• US 9,414,501 B2
• Filed: 03/14/2013
• Issued: 08/09/2016
• Est. Priority Date: 01/04/2012
• Status: Active Grant

• Current Assignee: Board of Regents of the University of Texas System (University of Texas System)
• Original Assignee: Board of Regents of the University of Texas System (University of Texas System)
• Inventors: Wicker, Ryan B., Medina, Francisco, MacDonald, Eric, Muse, Danny W., Espalin, David
• Primary Examiner(s): Nguyen, Donghai D
• Application Number:
  US13/829,921
• Publication Number:
  US 20140268607A1
• Time in Patent Office: 1,244 Days
• Field of Search: 29830-832, 298/40, 298/46, 298/50, 174/260, 174/261, 257/781, 257/784
• US Class Current: 1/1
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/4847 the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/85203 Thermocompression bonding
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/85214 using a laser
• CPC Class Codes: H01L 2224/85238 using electric resistance welding, i.e. ohmic heating
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/85801 Soldering or alloying
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/1301 : Thyristor
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H05K 1/0284 : Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/0296 : Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18
• CPC Class Codes: H05K 2201/0129 : Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/09036 : Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/09681 : Mesh conductors, e.g. as a ground plane
• CPC Class Codes: H05K 2201/10977 : Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 2203/0195 : Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/0285 : Using ultrasound, e.g. for cleaning, soldering or wet treatment
• CPC Class Codes: H05K 2203/049 : Wire bonding
• CPC Class Codes: H05K 3/103 : by bonding or embedding conductive wires or strips
• CPC Class Codes: H05K 3/321 : by conductive adhesives
• CPC Class Codes: H05K 3/328 : by welding
• CPC Class Codes: H05K 3/34 : by soldering
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/5193 : Electrical connector or terminal

Abstract

The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

Claims

1. A method of connecting a first component or conductor to a second component or conductor in a three-dimensional electronic, electromagnetic or electromechanical device comprising the steps of:

providing at least a first layer of a substrate material having the first component or conductor disposed on or within the first layer;

depositing a second layer of the substrate material on the first layer, wherein the second layer includes an elongated cavity having a first end and a second end such that the first end is disposed above a first exposed portion of the first component or conductor;

attaching a first end of a filament to the first exposed portion of the first component or conductor via the first end of the elongated cavity;

placing a second end of the filament within the second end of the elongated cavity such that the filament is disposed within the elongated cavity;

depositing a third layer of the substrate material on the second layer such that a first portion of the elongated cavity proximate to the first end of the elongated cavity is covered by the third layer and a second portion of the elongated cavity is exposed;

depositing the second component or conductor on or within the third layer proximate to the second portion of the elongated cavity;

depositing a fourth layer of the substrate material on the third layer such that a second portion of the second component or conductor is exposed and the second portion of the elongated cavity is exposed; and

removing the second end of the filament from the second portion of the elongated cavity and attaching the second end of the filament to the exposed second portion of the second component or conductor.

2. The method as recited in claim 1, wherein the second end of the elongated cavity is larger than the first end of the elongated cavity.

3. The method as recited in claim 1, wherein the elongated cavity comprises a keyhole shaped cavity or a spiral shaped cavity or a relief.

4. The method as recited in claim 1, further comprising the step of covering the first end of the elongated cavity with the substrate material after the filament is placed within the elongated cavity.

5. The method as recited in claim 1, wherein the elongated cavity is formed when the second layer of the substrate material is deposited on the first layer.

6. The method as recited in claim 1, wherein the elongated cavity is created by removing a portion of the substrate material of the second layer.

7. The method as recited in claim 6, wherein the portion of the substrate material of the second layer is removed using a micro-machining machine, a CNC micro-machining machine, a micro electrical discharge machining machine, an electrochemical machining machine, a direct write proton micro-machining machine, a laser ablation machine, a radiative source, an ultrasonic cutting machine, a hot wire cutting machine, a waterjet machine, an etching machine, a deep reactive ion etching machine, a plasma etching machine, a crystal orientation dependent etching machine, a wet bulk micromachining machine, a UV-lithography or X-ray lithography (LIGA) machine, a hot embossing lithography machine, a precision mechanical sawing machine, a chemically assisted ion milling machine, a sand blasting machine or a cutting machine.

8. The method as recited in claim 1, wherein the first end of the filament is attached to the first component or conductor and the second end of the filament is attached to the second component or conductor using a laser micro-welding process.

9. The method as recited in claim 1, wherein the first end of the filament is attached to the first component or conductor and the second end of the filament is attached to the second component or conductor using a wire bonding machine, a resistance welding machine, an ultrasonic welding machine, or a solder machine.

10. The method as recited in claim 1, further comprising the step of creating one or more additional layers of the three-dimensional substrate by depositing the substrate material on the second layer in a layer-by-layer process.

11. The method as recited in claim 1, wherein at least a portion of the first layer where the filament is embedded is not flat.

12. The method as recited in claim 1, wherein the filament comprises a conductive material, a non-conductive material, an optical fiber or a mesh.

13. The method as recited in claim 12, wherein:

the conductive material comprises a metal, a metal alloy, a conductive polymer or a wire;

the non-conductive material comprises one or more carbon fibers or one or more Kevlar fibers;

the mesh comprises a conductive mesh or a non-conductive mesh;

the conductive mesh comprises a set of filaments made of a metal, a metal alloy, a conductive polymer or a wire; and

the non-conductive mesh comprises a set of carbon fibers or Kevlar fibers.

14. The method as recited in claim 12, wherein the mesh comprises a stainless steel mesh, an aluminum mesh, a copper mesh, a brass mesh, a steel mesh, a copper chromium mesh, or a copper-nickel alloy mesh.

15. The method as recited in claim 12, wherein the mesh comprises a geometrical shape.

16. The method as recited in claim 12, wherein the mesh comprises a heat sink, an antenna, a conductive plane, a mechanical reinforcement, or an electromagnetic shield.

17. The method as recited in claim 12, wherein the mesh is embedded into the first layer to form a polymer-mesh composite material.

18. The method as recited in claim 12, wherein the mesh is embedded into the first layer one portion at a time using a multi-step process.

19. The method as recited in claim 12, wherein the mesh is embedded into the first layer in a single process step.

20. The method as recited in claim 12, wherein the first layer includes a cavity and a portion of the mesh is disposed within the cavity.

21. The method as recited in claim 12, wherein the mesh improves a physical characteristic, a thermal characteristic, or an electrical characteristic of the first layer, or the three-dimensional electronic, electromagnetic or electromechanical device.

22. The method as recited in claim 1, wherein the first layer includes a cavity and a portion of the filament is disposed within the cavity.

23. The method as recited in claim 1, wherein the filament improves a physical characteristic, a thermal characteristic, or an electrical characteristic of the first layer.

24. The method as recited in claim 1, wherein the substrate material comprises a thermoplastic material, or a thermoplastic material which is filled with another polymer material, a ceramic material, a metallic material, a mineral material, a glass ceramic material, a semi-conductor material, a nanomaterial, a biomaterial, an organic material, an inorganic material or any combination thereof to enhance mechanical, thermal, dielectric, magnetic, or electromagnetic properties.

25. The method as recited in claim 24, wherein the thermoplastic material comprises acrylonitrile butadiene styrene (ABS), ABSi, ABSplus, ABS-M30, ABS-M30i, ABS-ESDI, polycarbonate (PC), PC-ABS, PC-ISO, polyphenylsulfone (PPSF/PPSU), ULTEM 9085 or any combination thereof.

26. The method as recited in claim 25, wherein the another polymer material comprises poly(methyl methacrylate) (PMMA), polypropylene, polyolefin, LL-PE, HDPE, polyvinyl acetate, polyester, polyether, polyamides, nylon, polyimides, polyketone, polyether ethyl ketone (PEEK), polybutadiene, polylactic acid, polycaprolactone, polyethylene terephthalate, liquid crystalline polymer (LCP), polystyrene, polyvinyl chloride, polyfluoroethylene, polydifluoroethylene, polytetrafluoroethylene, ZEONEX RS420, Eccostock HIK-TPO, co-polymers and block co-polymers of the previous, or any combination thereof.

27. The method as recited in claim 1, wherein the one or more layers are deposited using a fused deposition modeling (FDM) process or other extrusion-based additive manufacturing processes, a selective laser sintering (SLS) process or other powder bed fusion additive manufacturing process, a laminated object manufacturing (LOM) process or other sheet lamination additive manufacturing process utilizing thermoplastic sheets, a stereolithography process or other vat photopolymerization additive manufacturing process utilizing photocurable thermoplastics, a material jetting process utilizing photocurable thermoplastics, or other additive thermoplastic-based 3D printing process.

28. The method as recited in claim 1, wherein the first component or conductor and the second component or conductor comprise an electronic component, an electrostatic component, a pneumatic component, an electroacoustic component, a Micro-Electro-Mechanical system (MEMS), a biomedical component, an electrochemical component, an electromechanical component, an electromagnetic component, a mechanical component, a metamaterial component, an optical component, a photonic component, a thermal component, a thermal management component, a mesh, an embedded conductor, a wire, a conductive pad, a conductive terminal, a conductive trace, a via to another layer or a connector.

29. The method as recited in claim 28, wherein the electronic component comprises an integrated circuit, a resistor, a capacitor, an inductor, a transistor, a thermistor, a thyristor, a sensor, a processor, a memory, an interface device, a display, a power source, an energy conversion device or an antenna.

30. The method as recited in claim 28, wherein the electronic component is placed by hand or using a component placement machine, wherein the component placement machine comprises a pick and place machine, a robotic process or other automated component placement technology.

31. The method as recited in claim 1, wherein the first component or conductor or the second component or conductor comprises an embedded conductor.

32. The method as recited in claim 31, wherein the embedded conductor is placed using a wire-feed and cutting system, and at least one energy source for embedding the filament or filament mesh selected from the group comprising:

an ultrasonic horn or sonotrode for generating frictional heat between at least a portion of the filament or filament mesh and the substrate;

an induction heating coil for inducing eddy currents and thereby Joule heat within at least a portion of the filament or filament mesh;

one or more resistive heating elements for generating and transferring heat by conduction to at least a portion of the filament or filament mesh;

electrodes for passing electrical current through at least a portion of the filament or filament mesh and thereby generating Joule heat within the filament or filament mesh;

an air heating and circulating device or system to transfer heat to at least a portion of the filament or filament mesh by forced convection heating; and

a radiant infrared heat source to transfer heat radiatively to at least a portion of the filament or filament mesh.