Multi-layer wire structure for high efficiency wireless communication

• US 9,439,287 B2
• Filed: 09/15/2011
• Issued: 09/06/2016
• Est. Priority Date: 03/09/2009
• Status: Active Grant

• Current Assignee: NuCurrent, Inc.
• Original Assignee: NuCurrent, Inc.
• Inventors: Singh, Vinit, Frysz, Christine A.
• Primary Examiner(s): Thompson, Timothy
• Assistant Examiner(s): Egoavil, Guillermo
• Application Number:
  US13/233,751
• Publication Number:
  US 20130068507A1
• Time in Patent Office: 1,818 Days
• Field of Search: 174/113.R, 174/251, 336/115, 336/65, 336/83, 336/200, 336/232, 336/192, 307/104
• US Class Current: 1/1
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602

Abstract

A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.

Claims

1. A structure comprising:

a) a plurality of conductors;

b) an insulator separating each of the conductors, thereby forming the structure configured to propagate an electrical signal through at least one of the conductors; and

c) wherein the structure is capable of exhibiting a quality factor greater than 100.

2. The structure of claim 1 wherein the plurality of conductors comprises at least one of a conductive tape, a conductive ribbon, and a deposited metal.

3. The structure of claim 1 wherein at least one connector connects two or more of the plurality of conductors.

4. The structure of claim 3 wherein the at least one connector comprises at least one of a via, a solder, a tab, a wire, a pin, and a rivet.

5. The structure of claim 1 wherein the electrical signal is propagated at a frequency that ranges from about 100 kHz to about 3 MHz.

6. The structure of claim 1 wherein the electrical signal is propagated at a frequency that ranges from about 3 MHz to about 10 GHz.

7. The structure of claim 5 wherein the frequency is in a frequency band that is within the range of about 100 kHz to about 3 MHz.

8. The structure of claim 6 wherein the frequency is in a frequency band that is within the range of about 3 MHz to about 10 GHz.

9. The structure of claim 1 wherein each of the plurality of conductors is in a parallel orientation.

10. The structure of claim 1 wherein the plurality of conductors are connected electrically in parallel.

11. The structure of claim 10 wherein the plurality of conductors connected electrically in parallel are connected electrically in series with a second plurality of conductors connected electrically in parallel.

12. The structure of claim 1 wherein the electrical signal comprises at least one of an energy signal, a power signal, and a data signal.

13. The structure of claim 1 wherein the electrical signal comprises at least one of an electrical current, an electrical voltage, and a digital data signal.

14. The structure of claim 1 having a cross-sectional shape comprising at least one of a circular cross-section, a rectangular cross-section, a square cross-section, a triangular cross-section, and an elliptical cross-section.

15. The structure of claim 1 having a structural shape comprising at least one of a circular solenoidal configuration, a square solenoidal configuration, a circular spiral configuration, a square spiral configuration, a rectangular configuration, a triangular configuration, a circular spiral-solenoidal configuration, a square spiral-solenoidal configuration, and a conformal solenoid configuration.

16. The structure of claim 1 wherein the plurality of conductors has at least one turn.

17. The structure of claim 1 wherein at least one of the plurality of conductors is formed from an electrically conductive material.

18. The structure of claim 17 wherein the electrically conductive material comprises at least one of copper, titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hafnium, nitinol, Co—

Cr—

Ni alloys, stainless steel, gold, a gold alloy, palladium, carbon, silver, a noble metal, and a biocompatible material.

19. The structure of claim 1 wherein the insulator is formed from an electrically insulative material.

20. The structure of claim 19 wherein the electrically insulative material comprises at least one of air, polystyrene, silicon dioxide, a ceramic material, and a ferrite material.

21. The structure of claim 1 further incorporatable within a device comprising at least one of a resonator, an antenna, an RFID tag, an RFID transponder, and a medical device.

22. The wire structure of claim 1 wherein each of the plurality of conductors has a conductor thickness and a conductor skin depth, and wherein the conductor skin depth ranges from about one-half of the conductor thickness to about equal to the conductor thickness.

23. The wire structure of claim 1 wherein each of the plurality of conductors has a conductor thickness and a conductor skin depth, and wherein the conductor thickness is substantially the same or greater than the thickness of the respective conductor skin depth.