Resonant apparatus for wireless power transfer

• US 9,508,488 B2
• Filed: 01/10/2013
• Issued: 11/29/2016
• Est. Priority Date: 01/10/2012
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kholodnyak, Dmitry Victorovich, Zameshaeva, Evgenia Yurevna, Vendik, Orest Genrihovich, Vendik, Irina Borisovna, Turalchuk, Pavel Anatolevich, Kozlov, Dmitry Sergeevich, Kim, Ki Young, Olyunin, Nikolay Nikolaevich
• Primary Examiner(s): Tran, Thienvu
• Assistant Examiner(s): Stables, David M
• Application Number:
  US13/738,064
• Publication Number:
  US 20130187475A1
• Time in Patent Office: 1,419 Days
• Field of Search: 307/104
• US Class Current: 1/1
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H02J 50/05 using capacitive coupling
• CPC Class Codes: H02J 50/12 of the resonant type
• CPC Class Codes: H02J 50/40 using two or more transmitting or receiving devices H02J50/50 takes precedence
• CPC Class Codes: H02J 50/80 involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
• CPC Class Codes: H04B 5/26 using coils
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer

Abstract

Provided is a bulk acoustic resonator (BAR)-based resonant structure in relation to electric and radio technologies, and more particularly, to a wireless power transmission system. A resonant apparatus for wireless power transmission may include a conducting loop, and a high quality capacitor. The high quality capacitor may include a metacapacitor including a thin piezoelectric layer disposed between two metal electrodes. The metacapacitor may be disposed between two dielectric layers of which central portions are etched, and the conducting loop may be disposed on an upper layer of the two dielectric layers.

Claims

1. A resonant apparatus for wireless power transmission, the resonant apparatus comprising:

a conducting loop;

two dielectric layers of which central portions are etched; and

a capacitor comprising a metacapacitor, the metacapacitor comprising two metal electrodes and a piezoelectric layer disposed between the two metal electrodes,

wherein the metacapacitor is disposed on a lower dielectric layer of the two dielectric layers,

wherein an upper dielectric layer of the two dielectric layers is disposed on an upper electrode of the two metal electrodes, and

wherein the conducting loop is disposed on the upper layer of the two dielectric layers.

2. The resonant apparatus of claim 1, wherein the conducting loop comprises a planar conductor that has a thickness that is less than a width of the planar conductor.

3. The resonant apparatus of claim 1, wherein the conducting loop comprises a shape of a circle.

4. The resonant apparatus of claim 1, wherein the central portions of the dielectric layers are etched to provide a free space for acoustic oscillation of a resonator membrane.

5. The resonant apparatus of claim 1, wherein a thickness of the upper dielectric layer is determined to reduce an impact of a parasitic capacitance between the conducting loop and the upper electrode of the metacapacitor.

6. The resonant apparatus of claim 1, wherein a thickness of the lower dielectric layer of the two dielectric layers is determined to ensure a mechanical strength of the resonant apparatus.

7. The resonant apparatus of claim 1, wherein the conducting loop is connected to the two metal electrodes of the metacapacitor by metalized via holes or external connectors.

8. The resonant apparatus of claim 1, wherein the piezoelectric layer of the metacapacitor comprises a ceramic material having a piezoelectric effect.

9. The resonant apparatus of claim 1, wherein the piezoelectric layer of the metacapacitor comprises plumbum titanate-zirconate (Pb(Zr_xTi_1-x)O₃ (PZT)).

10. The resonant apparatus of claim 1, wherein the piezoelectric layer of the metacapacitor comprises a mono-crystalline material having an electromechanical coupling coefficient above a threshold, a quality factor (Q-factor) above a second threshold, and a dielectric loss below a third threshold.

11. The resonant apparatus of claim 1, wherein a structure of the resonant apparatus comprises a planar multilayer structure made by a thin film technology.

12. The resonant apparatus of claim 1, wherein a structure of the resonant apparatus comprises a circular structure or a polygonal structure.

13. The resonant apparatus of claim 1, wherein a diameter of the resonant apparatus is smaller than a hundredth of a wavelength.

14. The resonant apparatus of claim 1, wherein thicknesses of the two dielectric layers are determined to be thicknesses by which an acoustic oscillation of a shear wave resonates at a frequency exceeding a system operating frequency.

15. The resonant apparatus of claim 1, wherein the metacapacitor is operated as an acoustic resonator, and an external impedance at a system operating frequency of the acoustic resonator is equivalent to an impedance of a capacitor having a capacitance value above a threshold.

16. The resonant apparatus of claim 1, wherein a capacitance value of the metacapacitor is determined to ensure a resonant response of the resonant apparatus at a selected system operating frequency, in combination with an inductance of the conducting loop.

17. The resonant apparatus of claim 1, wherein the piezoelectric layer and the lower dielectric layer of dielectric layers are separately disposed by a lower electrode of the two metal electrodes, and the piezoelectric layer and the upper dielectric layer of dielectric layers are separately disposed by the upper electrode of the two metal electrodes.

18. A wireless power transmission device, comprising:

a metacapacitor comprising an upper electrode layer, an lower electrode layer and a piezoelectric layer that is disposed between the upper electrode layer and the lower electrode layer;

two dielectric layers of which central portions are etched, wherein the metacapacitor is disposed on a lower dielectric layer of the two dielectric layers, and wherein an upper dielectric layer of the two dielectric layers is disposed on the upper electrode layer; and

a conducting loop layer disposed on the upper dielectric layer of the two dielectric layers,

wherein the wireless power transmission device is configured to transfer and/or receive power wirelessly through magnetic coupling.

19. The wireless power transmission device of claim 18, wherein the conducting loop is connected to the upper electrode layer and the lower electrode layer of the metacapacitor by metalized holes.

20. The wireless power transmission device of claim 18, wherein the piezoelectric layer and the lower dielectric layer of dielectric layers are separately disposed by the lower electrode layer, and the piezoelectric layer and the upper dielectric layer of dielectric layers are separately disposed by the upper electrode layer.