Wafer-level light emitting diode package and method of fabricating the same
First Claim
1. A light emitting diode (LED) package, comprising:
- first and second light emitting cells, each comprising a first semiconductor layer, an active layer and a second semiconductor layer, wherein the second semiconductor layer and the active layer of each light emitting cell provides a contact region exposing the first semiconductor layer of each of the light emitting cells;
a first protective insulation layer covering a sidewall of each of the light emitting cells;
a connector located arranged on a first side of the light emitting cells and electrically connecting two adjacent light emitting cells to each other;
a first bump arranged on the first side of the light emitting cells and electrically connected to the first semiconductor layer via the contact region of the first light emitting cell;
a second bump arranged on the first side of the light emitting cells and electrically connected to the second semiconductor layer of the second light emitting cell;
a first contact layer arranged on the exposed first semiconductor layer;
a second contact layer arranged on the second semiconductor layer; and
a second protective insulation layer arranged between the first bump and the first contact layer,wherein the first semiconductor layer comprises a roughened surface, andwherein each light emitting cell comprises an inclined sidewall.
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Accused Products
Abstract
Exemplary embodiments of the present invention provide a wafer-level light emitting diode (LED) package and a method of fabricating the same. The LED package includes a semiconductor stack including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a plurality of contact holes arranged in the second conductive type semiconductor layer and the active layer, the contact holes exposing the first conductive type semiconductor layer; a first bump arranged on a first side of the semiconductor stack, the first bump being electrically connected to the first conductive type semiconductor layer via the plurality of contact holes; a second bump arranged on the first side of the semiconductor stack, the second bump being electrically connected to the second conductive type semiconductor layer; and a protective insulation layer covering a sidewall of the semiconductor stack.
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Citations
20 Claims
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1. A light emitting diode (LED) package, comprising:
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first and second light emitting cells, each comprising a first semiconductor layer, an active layer and a second semiconductor layer, wherein the second semiconductor layer and the active layer of each light emitting cell provides a contact region exposing the first semiconductor layer of each of the light emitting cells; a first protective insulation layer covering a sidewall of each of the light emitting cells; a connector located arranged on a first side of the light emitting cells and electrically connecting two adjacent light emitting cells to each other; a first bump arranged on the first side of the light emitting cells and electrically connected to the first semiconductor layer via the contact region of the first light emitting cell; a second bump arranged on the first side of the light emitting cells and electrically connected to the second semiconductor layer of the second light emitting cell; a first contact layer arranged on the exposed first semiconductor layer; a second contact layer arranged on the second semiconductor layer; and a second protective insulation layer arranged between the first bump and the first contact layer, wherein the first semiconductor layer comprises a roughened surface, and wherein each light emitting cell comprises an inclined sidewall. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A light emitting diode (LED) module, comprising:
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a circuit board; a LED package arranged on the circuit board; and a light guide to adjust an orientation angle of light emitted from the LED package, wherein the LED package includes; first and second light emitting cells, each light emitting cell comprising a first semiconductor layer, an active layer and a second semiconductor layer and each light emitting cell having contact holes forming through the second semiconductor layer and the active layer and exposing the first semiconductor layer; a first contact layer contacting with the first semiconductor layer of each light emitting cell; a second contact layer contacting with the second semiconductor layer of each light emitting cell; a first electrode pad connected to the first contact layer of the first light emitting cell; a second electrode pad connected to the second contact layer of the second light emitting cell; and a connector connecting the second contact layer of the first light emitting cell to the first contact layer of the second light emitting cell so that the first and second light emitting cells are connected in series to each other, wherein the first contact layer has contact portions contacting with the first semiconductor layer and connecting portion connecting the contact portions to each other such that the contact portions are electrically connected to each other by the connecting portion. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification