Methods for forming electrically precise capacitors on insulative substrates, and structures formed therefrom
First Claim
1. A method of forming a capacitor, comprising:
- a. depositing a first metal layer on an insulative substrate to form a first capacitor electrode;
b. depositing a first insulating layer on said first metal layer by atomic layer deposition (ALD);
c. forming a second capacitor electrode on said first insulating layer;
d. forming a second insulating layer on said first insulating layer and on, adjacent to, or on and adjacent to said second capacitor electrode; and
e. printing a metal precursor ink on said first capacitor electrode and said second insulating layer.
1 Assignment
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Accused Products
Abstract
High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.
14 Citations
22 Claims
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1. A method of forming a capacitor, comprising:
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a. depositing a first metal layer on an insulative substrate to form a first capacitor electrode; b. depositing a first insulating layer on said first metal layer by atomic layer deposition (ALD); c. forming a second capacitor electrode on said first insulating layer; d. forming a second insulating layer on said first insulating layer and on, adjacent to, or on and adjacent to said second capacitor electrode; and e. printing a metal precursor ink on said first capacitor electrode and said second insulating layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of forming a capacitor, comprising:
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a. depositing a first metal layer on an insulative substrate to form a first capacitor electrode, wherein forming said first capacitor electrode comprises printing a metal precursor in a pattern corresponding to said first capacitor electrode; b. depositing a first insulating layer on said metal layer by atomic layer deposition (ALD); c. forming a second capacitor electrode on said first insulating layer; and d. forming a second insulating layer on said first insulating layer and on and/or adjacent to said second capacitor electrode. - View Dependent Claims (12, 13, 14)
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15. A method of forming a capacitor, comprising:
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a. depositing a first metal layer on an insulative substrate having a barrier layer thereon to form a first capacitor electrode; b. depositing a first insulating layer on said metal layer by atomic layer deposition (ALD); c. forming a second capacitor electrode on said first insulating layer; and d. forming a second insulating layer on said first insulating layer and on and/or adjacent to said second capacitor electrode. - View Dependent Claims (16, 17, 18)
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19. A method of forming a capacitor, comprising:
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a. depositing a first metal layer on an insulative substrate to form a first capacitor electrode; b. depositing a first insulating layer at a first thickness on said metal layer by atomic layer deposition (ALD); c. forming a second capacitor electrode on said first insulating layer; and d. depositing a second insulating layer at a second thickness on said first insulating layer and on and/or adjacent to said second capacitor electrode, said second thickness is greater than said first thickness. - View Dependent Claims (20)
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21. A method of forming a capacitor, comprising:
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a. depositing a first metal layer on an insulative substrate to form a first capacitor electrode; b. depositing a first insulating layer on said metal layer by atomic layer deposition (ALD); c. forming a second capacitor electrode on said first insulating layer; d. forming a second insulating layer on said first insulating layer and on and/or adjacent to said second capacitor electrode; and e. depositing a third insulating layer on said second capacitor electrode and said first insulating layer, and removing a portion of said first insulating layer to form an opening configured to expose a portion of said first capacitor electrode. - View Dependent Claims (22)
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Specification