RFID transponder chip modules

• US 9,622,359 B2
• Filed: 02/11/2015
• Issued: 04/11/2017
• Est. Priority Date: 08/08/2011
• Status: Active Grant

• Current Assignee: AmaTech Group Limited (Paragon Group Limited)
• Original Assignee: Féinics AmaTech Teoranta (Paragon Group Limited)
• Inventors: Finn, David, Lotya, Mustafa, Molloy, Darren
• Primary Examiner(s): LY, TOAN C
• Application Number:
  US14/619,186
• Publication Number:
  US 20150269471A1
• Time in Patent Office: 790 Days
• Field of Search: 235492
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/0006 taking account of the properties of the material involved B23K26/32, B23K26/40 take precedence
• CPC Class Codes: B23K 26/0622 by shaping pulses
• CPC Class Codes: B23K 26/352 for surface treatment
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: G06K 19/07794 the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H05K 3/46 Manufacturing multilayer circuits
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

The planar antenna (PA) of a transponder chip module (TCM) may have a U-shaped portion so that an outer end (OE) of the antenna may be positioned close to an RFID chip (IC) disposed at a central area of a module tape (MT) for the transponder chip module. A module tape (MT2) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT1) having a planar antenna (PA). Metal of a conductive layer (CL) within a conductive element such as a coupling frame (CF) or a planar antenna (PA) may be scribed to have many small segments. A metal sheet may be stamped to have contact side metallization, and joined with a module tape (MT) having a planar antenna (PA).

Claims

1. A method of making at least one connection through a substrate, comprising:

providing at least one through-hole extending through the substrate; and

deforming a portion of a first conductive layer (CL1) which spans the through-hole on one side of the substrate so that it extends through the through-hole and at least to the opposite side of the substrate whereat it may contact and be joined with a second conductive layer (CL2) on the opposite side of the substrate.

2. The method of claim 1, wherein:

the first conductive layer (CL1) is deformed with the second conductive layer disposed on the substrate.

3. The method of claim 1, wherein:

the second conductive layer is disposed on the substrate after the first conductive layer is deformed.

4. The method of claim 1, further comprising:

prior to deforming the portion of the first conductive layer, cutting or slitting it at the location of the through-hole, then bending it to come into contact with the conductive layer on the top, face-up side of the substrate.

5. The method of claim 1, wherein:

the substrate comprises an epoxy-glass module tape.

6. The method of claim 1, wherein:

the substrate has a thickness of approximately 70 μ

m - 100 μ

m.

7. The method of claim 1, wherein:

the at least one through-hole has a cross-dimensions of approximately 400 μ

m-600 μ

m.

8. The method of claim 1, wherein:

the first conductive layer comprises a copper foil.

9. The method of claim 8, wherein:

the copper foil has a thickness of approximately 18 μ

m-35 mm.

10. The method of claim 8, further comprising:

securing the copper foil to the substrate using an adhesive.

11. The method of claim 10, wherein:

the adhesive has a thickness of approximately 20 μ

m.

12. The method of claim 10, further comprising:

applying the adhesive so that it does not enter the through-hole.

13. The method of claim 1, wherein:

the second conductive layer comprises a copper foil.

14. The method of claim 13, wherein:

the copper foil has a thickness of approximately 18 μ

m-35mm.

15. The method of claim 13, further comprising:

securing the copper foil to the substrate using an adhesive.

16. The method of claim 15, wherein:

the adhesive has a thickness of approximately 20 μ

m.

17. The method of claim 15, further comprising:

applying the adhesive so that it does not enter the through-hole.