Terminal structure and semiconductor device
First Claim
1. A terminal structure comprising:
- a base material;
an electrode formed on the base material;
an insulating coating layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode;
an under-bump metal layer filling the opening and covering part of the insulating coating layer; and
a dome-shaped bump (i) covering the under-bump metal layer, (ii) being in direct contact with and covering part of the insulating coating layer, and (iii) continuously tapering inward from the insulating coating layer to a top of the dome-shaped bump, wherein;
in a cross section along a lamination direction, the under-bump metal layer has a convex shape toward the dome-shaped bump, and a thickness of the under-bump metal layer at a center of the opening is equal to or greater than the thickness of the under-bump metal layer at an end portion of the opening; and
a ratio R between distance AB from point A to point B and distance BC from point B to point C satisfies the following expression;
R=0.50≧
BC/AB≧
0.05.(i) on an upper surface of the insulating coating layer, point A being a position of an end on the opening side of the insulating coating layer, (ii) point B being a position of an end of the under-bump metal layer, and (iii) on a basis of the upper surface of the insulating coating layer, point C being a position where the thickness of the under-bump metal layer is half the thickness of the under-bump metal layer at point A.
1 Assignment
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Accused Products
Abstract
The present invention relates to a terminal structure comprising; a base material 10; an external electrode 20 formed on the base material; an insulating coating layer 30 formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under-bump metal layer 70 filling the opening and covering part of the insulating coating layer; and a dome-shaped bump 85 covering the under-bump metal layer, wherein in a cross section along a lamination direction, the under-bump metal layer has a convex shape toward the bump, and the thickness Tu0 of the under-bump metal layer at a center of the opening is equal to or greater than the thickness Tu1 of the under-bump metal layer at an end portion of the opening.
26 Citations
9 Claims
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1. A terminal structure comprising:
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a base material; an electrode formed on the base material; an insulating coating layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under-bump metal layer filling the opening and covering part of the insulating coating layer; and a dome-shaped bump (i) covering the under-bump metal layer, (ii) being in direct contact with and covering part of the insulating coating layer, and (iii) continuously tapering inward from the insulating coating layer to a top of the dome-shaped bump, wherein; in a cross section along a lamination direction, the under-bump metal layer has a convex shape toward the dome-shaped bump, and a thickness of the under-bump metal layer at a center of the opening is equal to or greater than the thickness of the under-bump metal layer at an end portion of the opening; and a ratio R between distance AB from point A to point B and distance BC from point B to point C satisfies the following expression;
R=0.50≧
BC/AB≧
0.05.(i) on an upper surface of the insulating coating layer, point A being a position of an end on the opening side of the insulating coating layer, (ii) point B being a position of an end of the under-bump metal layer, and (iii) on a basis of the upper surface of the insulating coating layer, point C being a position where the thickness of the under-bump metal layer is half the thickness of the under-bump metal layer at point A. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification