Apparatus, system and method for use in mounting electronic elements
First Claim
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1. A surface mount device comprising:
- a casing comprising a first surface, a second surface opposite said first surface, and at least one side surface;
a recess formed in said first surface and extending at least partially into said casing;
a plurality of leads at least partially encased by said casing, wherein each of said leads comprises a surface mount area at a first end, a device coupling area at a respective opposite end, and an extended lead portion extending between said surface mount area and said device coupling area, wherein said extended lead portion comprises a width less than the width of said surface mount area, wherein at least one of said extended lead portions extends along said at least one side surface, wherein said leads are angled to align said device coupling areas along first and second perpendicular axes, and wherein said device coupling areas are narrower than the widths of said extended lead portions, said device coupling areas straddling said first and second perpendicular axes;
one or more electronic or optoelectronic devices coupled with at least one of said device coupling areas, said one or more electronic or optoelectronic devices exposed through said recess; and
a heat sink comprising a raised portion and an extended plate and a laterally and circumferentially extending shelf, wherein said raised portion protrudes from said extended plate, wherein said shelf comprises first and second opposing lateral surfaces and a tapered circumferential perimeter connecting the first and second opposing lateral surfaces and tapered toward a central axis of said heat sink, wherein said casing comprises a material that is partially below said extended plate and adjacent to said shelf, wherein at least a portion of each of said leads is in thermal contact with said raised portion, extends up the length and to the top of said raised portion, and is shaped to match the contours of and at least partially frame at least said raised portion, said one or more electronic or optoelectronic devices on a mounting surface of said heat sink, wherein said device coupling areas are proximate to said raised portion of said heat sink.
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Abstract
The present invention provides various embodiments for apparatuses, systems, and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices comprising a casing with a first and second surface and at least one side surface. A recess is formed in the first surface and extends into the casing. plurality of leads is partially encased by the casing, and one or more electronic devices are coupled with at least one of the plurality of leads and are at least partially exposed through the recess. A heat sink may be included for heat dissipation.
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Citations
36 Claims
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1. A surface mount device comprising:
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a casing comprising a first surface, a second surface opposite said first surface, and at least one side surface; a recess formed in said first surface and extending at least partially into said casing; a plurality of leads at least partially encased by said casing, wherein each of said leads comprises a surface mount area at a first end, a device coupling area at a respective opposite end, and an extended lead portion extending between said surface mount area and said device coupling area, wherein said extended lead portion comprises a width less than the width of said surface mount area, wherein at least one of said extended lead portions extends along said at least one side surface, wherein said leads are angled to align said device coupling areas along first and second perpendicular axes, and wherein said device coupling areas are narrower than the widths of said extended lead portions, said device coupling areas straddling said first and second perpendicular axes; one or more electronic or optoelectronic devices coupled with at least one of said device coupling areas, said one or more electronic or optoelectronic devices exposed through said recess; and a heat sink comprising a raised portion and an extended plate and a laterally and circumferentially extending shelf, wherein said raised portion protrudes from said extended plate, wherein said shelf comprises first and second opposing lateral surfaces and a tapered circumferential perimeter connecting the first and second opposing lateral surfaces and tapered toward a central axis of said heat sink, wherein said casing comprises a material that is partially below said extended plate and adjacent to said shelf, wherein at least a portion of each of said leads is in thermal contact with said raised portion, extends up the length and to the top of said raised portion, and is shaped to match the contours of and at least partially frame at least said raised portion, said one or more electronic or optoelectronic devices on a mounting surface of said heat sink, wherein said device coupling areas are proximate to said raised portion of said heat sink. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A surface mount device comprising:
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a casing comprising a first surface, a recess formed in said first surface and extending at least partially into said casing, and at least one side surface; a plurality of leads at least partially encased by said casing and extending from the recess through the casing and exiting the casing, wherein each of said leads comprises a surface mount area, a device coupling area, and an extended lead portion extending therebetween, wherein said extended lead portion comprises a width less than the width of said surface mount area, wherein at least one of said extended lead portions extends along said at least one side surface, wherein said leads are angled to align said device coupling areas along first and second perpendicular axes and wherein said device coupling areas are narrower than the widths of said extended lead portions, said device coupling areas straddling said first and second perpendicular axes; at least one electronic device coupled with at least one of said device coupling areas and at least partially exposed through the recess; and a heat sink proximate said plurality of leads and secured in said recess, said heat sink comprising a raised portion at least partially framed by portions of said leads in thermal contact with said raised portion and extending up the length and to the top of said raised portion, said heat sink comprising an extended plate and a laterally and circumferentially extending shelf, wherein said raised portion protrudes from said extended plate, wherein said shelf comprises first and second opposing lateral surfaces and a tapered circumferential perimeter connecting the first and second opposing lateral surfaces and tapered toward a central axis of said heat sink, wherein said casing comprises a material that is partially below said extended plate and adjacent to said shelf, said at least one electronic device on a mounting surface of said heat sink, wherein said device coupling areas are proximate to said raised portion of said heat sink. - View Dependent Claims (16, 17, 18, 19, 20)
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21. A surface mount device comprising:
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a casing comprising a first surface, a second surface opposite said first surface, and at least one side surface; a recess formed in said first surface and extending at least partially into said casing; a lens positioned relative to and protruding from said first surface; a plurality of leads at least partially encased by said casing and extending from the recess through the casing and exiting the casing, wherein each of said leads comprises a surface mount area, a device coupling area, and an extended lead portion extending between the surface mount and device coupling areas, wherein said extended lead portion comprises a width less than the width of said surface mount area, wherein at least one of said extended lead portions extends along said at least one side surface, wherein said leads are angled to align said device coupling areas along first and second perpendicular axes and wherein said device coupling areas are narrower than the widths of said extended lead portions, said device coupling areas straddling said first and second perpendicular axes; and a heat sink secured in said recess of said casing, said heat sink comprising a raised portion at least partially framed by portions of said leads in thermal contact with said raised portion and extending up the length and to the top of said raised portion, said heat sink comprising an extended plate and a laterally and circumferentially extending shelf, wherein said raised portion protrudes from said extended plate, wherein said shelf comprises first and second opposing lateral surfaces and a tapered circumferential perimeter connecting the first and second opposing lateral surfaces and tapered toward a central axis of said heat sink, wherein said casing comprises a material that is partially below said extended plate and adjacent to said shelf, wherein said device coupling areas are proximate to said raised portion of said heat sink. - View Dependent Claims (22, 23, 24, 25)
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26. A method for use in manufacturing a surface mount device, the method comprising:
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providing a casing with at least one side surface; positioning a plurality of leads, wherein each of said leads comprises a surface mount area at a first end, a device coupling area at a respective opposite end, and an extended lead portion extending between said surface mount area and said device coupling area, wherein said extended lead portion comprises a width less than the width of said surface mount area, wherein at least one of said extended lead portions extends along said at least one side surface, wherein said leads are angled to align said device coupling areas along first and second perpendicular axes, and wherein said device coupling area are narrower than the widths of said extended lead portions, said device coupling areas straddling said first and second perpendicular axes; positioning a heat sink proximate to at least a portion of said plurality of leads, said heat sink comprising a raised portion at least partially framed by portions of said leads in thermal contact with said raised portion and extending up the length and to the top of said raised portion, said heat sink comprising an extended plate and a laterally and circumferentially extending shelf, wherein said raised portion protrudes from said extended plate, wherein said shelf comprises first and second opposing lateral surfaces and a tapered circumferential perimeter connecting the first and second opposing lateral surfaces and tapered toward a central axis of said heat sink, wherein said casing comprises a material that is partially below said extended plate and adjacent to said shelf, wherein said device coupling areas are proximate to said raised portion of said heat sink; securing said plurality of leads and heat sink with said casing such that the heat sink is maintained at a predefined position relative to said leads; and mounting an electronic device on a mounting surface of said heat sink such that at least a portion of said electronic device is exposed through a recess in said casing. - View Dependent Claims (27, 28, 29, 30, 31, 32)
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33. A surface mount device comprising:
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a casing comprising a first surface and a recess formed in said first surface and extending at least partially into said casing; a plurality of leads at least partially encased by said casing and extending from the recess through the casing and exiting the casing; at least one electronic device coupled with at least one of the plurality of leads and at least partially exposed through the recess; and a heat sink proximate said plurality of leads and secured in said recess, said heat sink comprising an extended plate and a laterally and circumferentially extending shelf, wherein said shelf comprises first and second opposing lateral surfaces and a tapered circumferential perimeter connecting the first and second opposing lateral surfaces and tapered toward a central axis of said jheat sink, wherein said extended plate is positioned between said extending shelf and a pedestal section of said heat sink. - View Dependent Claims (34, 35, 36)
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Specification