Apparatus, system and method for use in mounting electronic elements

• US 20080218973A1
• Filed: 02/12/2008
• Published: 09/11/2008
• Est. Priority Date: 02/12/2007
• Status: Active Grant

• Current Assignee: Cree Huizhou Solid State Lighting Company Limited (Smart Global Holdings Incorporated)
• Original Assignee: COTCO Luminant Device Ltd. (Wolfspeed, Inc.)
• Inventors: Wang, Xuan, Xie, Jian-Hui, Leung, Chi Wing
• Granted Patent: US 9,711,703 B2
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: F21V 29/503 of light sources cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H01L33/64
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00

Abstract

The present invention provides various embodiments for apparatuses, systems, and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices comprising a casing with a first and second surface and at least one lateral side surface. A recess is formed in the first surface and extends into the casing. A plurality of leads is partially encased by the casing, and one or more electronic devices are coupled with at least one of the plurality of leads and are at least partially exposed through the recess. A heat sink may be included for heat dissipation.

Claims

1. A surface mount device comprising:

a casing comprising a first surface, a second surface opposite said first surface, and at least one lateral side surface;

a recess formed in said first surface and extending at least partially into said casing;

a plurality of leads at least partially encased by said casing; and

one or more electronic and/or optoelectronic devices coupled with at least one of the plurality of leads and at least partially exposed through the recess.

2. The surface mount device of claim 1, further comprising a lens positioned relative to and protruding from said first surface.

3. The surface mount device of claim 1, wherein at least one of said plurality of leads extends through at least one of said lateral sides surfaces, and at least one of another of said plurality of leads extends through at least one of another of said lateral side surfaces.

4. The surface mount device of claim 1, wherein at least a portion of each of said leads is exposed outside of said casing and/or within said recess.

5. The surface mount device of claim 1, further comprising a heat sink secured in said recess.

6. The surface mount device of claim 5, wherein said heat sink is positioned proximate to at least a portion of at least one of said plurality of leads.

7. The surface mount device of claim 5, wherein said heat sink is comprised of a thermally conductive material.

8. The surface mount device of claim 5, wherein said heat sink is generally cylindrically shaped.

9. The surface mount device of claim 5, wherein said heat sink comprises a pedestal portion comprising an extended plate and a base.

10. The surface mount device of claim 9, wherein the diameter of said extended plate is greater than the diameter of said base.

11. The surface mount device of claim 9, wherein said base comprises a laterally and circumferentially extending shelf.

12. The surface mount device of claim 9, wherein the diameter at the base of said pedestal portion is greater than the diameter at the top of said pedestal portion.

13. The surface mount device of claim 5, wherein said heat sink comprises a mounting surface coupled with at least one electronic and/or optoelectronic device.

14. The surface mount device of claim 5, wherein said heat sink comprises at least one through-hole.

15. A surface mount device comprising:

a casing comprising a first surface and a recess formed in said first surface and extending at least partially into said casing;

a plurality of leads at least partially encased by said casing and extending from the recess through the casing and exiting the casing;

at least one electronic device coupled with at least one of the plurality of leads and at least partially exposed through the recess; and

a heat sink proximate said plurality of leads and secured in said recess.

16. The surface mount device of claim 15, further comprising a lens positioned relative to and protruding from said first surface.

17. The surface mount device of claim 15, wherein said heat sink comprises:

a pedestal portion with an extended plate and a base;

a mounting surface coupled with at least one electronic device; and

at least one through-hole.

18. The surface mount device of claim 17, wherein said heat sink is comprised of a thermally conductive material.

19. The surface mount device of claim 17, wherein said heat sink is coupled with at least one of said plurality of leads.

20. A surface mount device comprising:

a casing comprising a first surface and a second surface opposite said first surface;

a recess formed in said first surface and extending at least partially into said casing;

a lens positioned relative to and protruding from said first surface;

a plurality of leads at least partially encased by said casing and extending from the recess through the casing and exiting the casing; and

a heat sink secured in said recess of said casing.

21. The surface mount device of claim 20, wherein one or more electronic and/or optoelectronic devices are coupled with at least one of said plurality of leads and are at least partially exposed through the recess.

22. A method for use in manufacturing a surface mount device, the method comprising:

positioning a plurality of leads;

positioning a heat sink proximate to at least a portion of said plurality of leads;

securing said plurality of leads and heat sink with a casing such that the heat sink is maintained at a predefined position relative to said leads; and

mounting an electronic device on said heat sink such that at least a portion of said electronic device is exposed through a recess in said casing.

23. The method of claim 22, wherein securing said plurality of leads and heat sink with the casing comprises:

securing the plurality of leads with the casing such that at least a portion of at least one of the plurality of leads is exposed through said recess and at least a portion of at least one of the plurality of leads is exposed outside said casing; and

securing the heat sink with the casing such that at least a portion of a contact surface and at least a portion of a mounting surface of the heat sink are exposed through said casing.

24. The method of claim 22, wherein a lens is formed about said recess effectively covering said exposed portion of the mounted device.

25. The method of claim 24, wherein said lens and casing are formed using injection molding.