Metal/ceramic bonding substrate and method for producing same

• US 9,713,253 B2
• Filed: 03/29/2011
• Issued: 07/18/2017
• Est. Priority Date: 03/23/2011
• Status: Active Grant

• Current Assignee: DOWA Metaltech Co., Ltd. (DOWA Holdings Company Limited)
• Original Assignee: DOWA Metaltech Co., Ltd. (DOWA Holdings Company Limited)
• Inventors: Kotani, Hirotaka, Takahashi, Takayuki, Ideguchi, Satoru, Osanai, Hideyo
• Primary Examiner(s): Sheikh, Humera
• Assistant Examiner(s): DUMBRIS, SETH M
• Application Number:
  US14/006,546
• Publication Number:
  US 20140057131A1
• Time in Patent Office: 2,303 Days
• Field of Search: 428614, 428627
• CPC Class Codes: B22D 19/0081 pretreatment of the insert, e.g. for enhancing the bonding between insert and surrounding cast metal
• CPC Class Codes: B22D 19/04 for joining parts
• CPC Class Codes: H01L 21/481 Insulating layers on insulating parts, with or without metallisation
• CPC Class Codes: H01L 21/4871 Bases, plates or heatsinks
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 2201/09136 Means for correcting warpage
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 2203/128 Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder spraying droplets of molten metal H05K2203/1344
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/022 Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
• CPC Class Codes: Y10T 428/12618 Plural oxides
• CPC Class Codes: Y10T 428/2457 Parallel ribs and/or grooves
• CPC Class Codes: Y10T 428/2462 with partial filling of valleys on outer surface
• CPC Class Codes: Y10T 428/24942 including components having same physical characteristic in differing degree

Abstract

A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.

Claims

1. A metal/ceramic bonding substrate comprising:

a ceramic substrate;

a metal plate bonded directly to one side of the ceramic substrate;

a metal base plate bonded directly to the other side of the ceramic substrate; and

a reinforcing plate member arranged so as to extend from one of both end faces in the directions of one of longitudinal and lateral directions of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof, the reinforcing plate member extending in parallel to the bonded surface, both end faces in longitudinal directions of the reinforcing plate member being exposed to the outside, the whole surface of the reinforcing plate member except for the both end faces thereof being bonded directly to the metal base plate.

2. A metal/ceramic bonding substrate as set forth in claim 1, wherein said metal base plate has a portion extending in directions perpendicular to said bonded surface.

3. A metal/ceramic bonding substrate as set forth in claim 1, wherein said reinforcing plate member has a surface which extends in parallel to said bonded surface and which has a portion facing said ceramic substrate, the portion of the surface of said reinforcing plate member having a smaller area than that of said bonded surface.

4. A metal/ceramic bonding substrate as set forth in claim 1, wherein said reinforcing plate member comprises a plurality of plate or rod members which are arranged on a plane extending in parallel to said bonded surface and which are spaced from each other at predetermined intervals to extend in parallel to each other.

5. A metal/ceramic bonding substrate as set forth in claim 1, wherein said reinforcing plate member is a lattice-shaped plate member comprising a plurality of longitudinal plate portions, which are arranged on a plane extending in parallel to said bonded surface and which are spaced from each other at predetermined intervals to extend in longitudinal directions of said metal base plate, and a plurality of lateral plate portions which are spaced from each other at predetermined intervals to extend in lateral directions of said metal base plate to connect the longitudinal plate portions to each other.

6. A metal/ceramic bonding substrate as set forth in claim 1, wherein said reinforcing plate member is made of a steel or a metal which contains iron and at least one selected from the group consisting of nickel, cobalt, copper and manganese.

7. A metal/ceramic bonding substrate as set forth in claim 1, wherein said reinforcing plate member is made of at least one ceramic selected from the group consisting of alumina, aluminum nitride, silicon nitride and silicon carbide.

8. A metal/ceramic bonding substrate as set forth in claim 1, wherein said metal base plate is made of aluminum or an aluminum alloy.

9. A metal/ceramic bonding substrate as set forth in claim 1, wherein said metal plate is made of aluminum or an aluminum alloy.

10. A metal/ceramic bonding substrate as set forth in claim 1, wherein said ceramic substrate is made of at least one ceramic selected from the group consisting of alumina, aluminum nitride, silicon nitride and silicon carbide.