Via definition scheme
First Claim
Patent Images
1. A method, comprising:
- defining a conductive line pattern layer over a first dielectric layer, wherein the first dielectric layer is disposed over a second dielectric layer, and wherein an opening in the conductive line pattern layer exposes a first portion of the first dielectric layer, the first portion having a first width;
forming spacers along sidewalls of the opening, wherein after forming the spacers a second portion of the first dielectric layer is exposed, the second portion of the first dielectric layer having a second width;
etching the second portion of the first dielectric layer using the spacers as a mask to expose a portion of the second dielectric layer;
removing the spacers after etching the second portion of the first dielectric layer, the removing exposing third portions of the first dielectric layer;
etching the third portions of the first dielectric layer to form a trench in the first dielectric layer, the trench having the first width; and
etching the portion of the second dielectric layer to form a via hole in the second dielectric layer, the via hole having the second width.
0 Assignments
0 Petitions
Accused Products
Abstract
A method includes defining a metal pattern layer over a first dielectric layer. The first dielectric layer is disposed over an etch stop layer and the etch stop layer is disposed over a second dielectric layer. A spacer layer is grown over the metal pattern layer and the first dielectric layer. A metal trench is formed with a metal width in the first dielectric layer. A via hole is formed with a via width in the second dielectric layer.
-
Citations
20 Claims
-
1. A method, comprising:
-
defining a conductive line pattern layer over a first dielectric layer, wherein the first dielectric layer is disposed over a second dielectric layer, and wherein an opening in the conductive line pattern layer exposes a first portion of the first dielectric layer, the first portion having a first width; forming spacers along sidewalls of the opening, wherein after forming the spacers a second portion of the first dielectric layer is exposed, the second portion of the first dielectric layer having a second width; etching the second portion of the first dielectric layer using the spacers as a mask to expose a portion of the second dielectric layer; removing the spacers after etching the second portion of the first dielectric layer, the removing exposing third portions of the first dielectric layer; etching the third portions of the first dielectric layer to form a trench in the first dielectric layer, the trench having the first width; and etching the portion of the second dielectric layer to form a via hole in the second dielectric layer, the via hole having the second width. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. An integrated circuit, comprising:
-
a metal line in a dielectric layer, an upper surface of the metal line being level with an upper surface of the dielectric layer, the upper surface of the metal line having a linear portion and an enlarged area in a plan view, the linear portion of the upper surface of the metal line having a first width along a first direction in the plan view, the enlarged area of the upper surface of the metal line having a second width along a second direction in the plan view, the first direction and the second direction being parallel in the plan view; and a conductive via extending from the metal line through an underlying dielectric layer, the conductive via being completely below the enlarged area in the plan view. - View Dependent Claims (9, 10, 11, 12, 13, 14)
-
-
15. An integrated circuit comprising:
-
one or more dielectric layers; a metal line extending from a top of the one or more dielectric layers; and a conductive via extending from the metal line to a bottom of the one or more dielectric layers, wherein a first portion of the metal line directly overlying the conductive via has a width greater than a second portion of the metal line not directly overlying the conductive via, an upper surface of the first portion being level with an upper surface of the second portion, the first portion extending a full width of the metal line, the second portion extending a full with of the metal line. - View Dependent Claims (16, 17, 18, 19, 20)
-
Specification